The SC450-LL sputtering system is a reliable, cost-effective, and high-performance tool. Semicore designs and manufactures precision thin film vacuum deposition systems and products, and its design initiatives and engineering talent contribute effectively to the capabilities, quality, and essential economy of the SC450-LL.
Features
The key features of the high performance SC450-LL sputtering system are as follows:
- Advanced fast cycle load-lock
- Active Deposition Area up to 200 mm (8”) diameter
- Accommodates various substrate shapes/sizes
- Small volume, fast cycle processing
- Fully automated, integrated controls
- Sequential or co-deposition modes
- Multiple sources (up to 4)
- In-situ cathode tilt
- Magnetron sources: 50 mm (2”), 75 mm (3”), or 100 mm (4”)
- Substrate table - etch/bias, heating/cooling, rotation
- Multiple process gas capability
- Confocal cathode arrangement
- DC, Pulse DC, RF (HF or MF) power supplies
- Integral cathode shutter
- R&D prototyping
Facilities Requirements
Process Gases
- ¼” VCR-4 connection type
- 138 - 207 kPa (20 - 30 psi.)
- 99.999% purity semiconductor grade
- Up to 3 different gases
Clean Dry Air
(Load lock or capacitance manometer option)
- 620 - 690 kPa (90 - 100 psi.)
- ¼” Swagelok® connection type
Nitrogen Vent
- ¼” Swagelok® connection type
- 13 - 207 kPa (2 - 30 psi)
- 99.999% purity semiconductor grade
Water
- ½” push fit connection type
- 7.6 -15 L/min (2.0 - 4.0 gpm)
- 13 - 27°C (55 - 80°F) water temperature
- Distilled water or Propylene Glycol mix
- 207 kPa (30 psi.) delta min
- 552 kPa (80 psi.) max inlet pressure
- 900 W - 2 kW cooling capacity required
Electrical
- Single phase
- 50/60 Hz
- 208 - 240 VAC
- 20 - 40 Ω