Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that its joint paper with Silicon Creations, “Silicon-Accurate Mixed-Signal Fractional-N PLL IP Design,” presented at TSMC’s 2012 Open Innovation Platform® (OIP) Ecosystem Forum has received the TSMC OIP Forum 2012 Customers’ Choice Award.
STATS ChipPAC Ltd., a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced two strategic etch system order wins from new MEMS customers in Asia. memsstar recently shipped its memsstar® R&D system to manufacturing customers in Korea and India for use in MEMS research and development, representing the first memsstar etch release system orders from these countries.
MEMC Singapore Pte. Ltd., a wholly owned subsidiary of MEMC Electronic Materials, Inc., and Flextronics, today celebrated the production of the one millionth MEMC Silvantis™ solar module at the Flextronics facility in Port of Tanjung Pelepas (PTP), Johor, Malaysia.
Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it will showcase its latest advancements in ion implantation at SEMICON Korea 2013.
Rice University scientists have taken an important step toward the creation of two-dimensional electronics with a process to make patterns in atom-thick layers that combine a conductor and an insulator.
The sun's energy is virtually limitless, but harnessing its electricity with today's single-crystal silicon solar cells is extremely expensive — 10 times pricier than coal, according to some estimates. Organic solar cells — polymer solar cells that use organic materials to absorb light and convert it into electricity — could be a solution, but current designs suffer because polymers have less-than-optimal electrical properties.
STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX: S24) today announced implementation of breakthrough performance and packaging innovation in multiple advanced chipsets for the rapidly developing smartphone market in China. Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC's packaging innovations for a number of its mobile chipsets.
Reportlinker.com announces that a new market research report is available in its catalogue: Wafer Packaging Fabs Database
The Nanotechnology Platform Project is a project which was commissioned by Japan’s Ministry of Education, Culture, Sports, Science and Technology (MEXT) with the aim of producing research results that will lead to innovations, in which 25 research institutions with leading-edge nanotechnology facilities and equipment in the three fields of Microstructural Characterization, Nanofabrication, and Molecule & Material Synthesis will provide opportunities for researchers in industry, academia, and government agencies throughout Japan to use those facilities.
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