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Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.

8 Jul 2014

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

Advanced Micro-Fabrication Equipment Inc. (AMEC) today introduced the Primo Integrated Dual-Station Etch and plasma downstream Asher ( Primo iDEA™), an industry-first semiconductor processing tool that integrates dual-station dielectric etch and photoresist strip chambers onto the same platform.

8 Jul 2014

New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.

From Applied Materials Inc. 8 Jul 2014

SEMICON West 2014: Minalogic and AEPI Partner to Promote the Rhône-Alpes Region

Minalogic , the leading French cluster dedicated to micro- and nanoelectronics and software, and AEPI , the Grenoble-Isère economic development agency, join their forces to promote the Rhône-Alpes Region during SEMICON West 2014 (booth 2028) and help visitors foster productive relationships with this very innovative territory ranked by Forbes, in 2013, as the 5th most inventive in the world.

8 Jul 2014

Mystery of the Printed Diode Solved

With an article published in the Proceedings of the National Academy of Sciences in the United States of America (PNAS), a thirteen-year-long mystery that has involved a long series of researchers at both Linköping University and Acreo Swedish ICT has finally been solved.

8 Jul 2014

Suny CNSE/ SUNY IT to Present on sub 10nm Chip Design at SEMICON West 2014

At the SEMICON West 2014 conference in San Francisco next week, the newly merged SUNY College of Nanoscale Science and Engineering/ SUNY Institute of Technology based in Albany, USA, will be detailing some of the research underway at its technology development centres including the use of III-V compounds in next generation chip technology.

7 Jul 2014

SMIC, Qualcomm Partner on 28nm Wafer Production for Snapdragon Processors

Semiconductor Manufacturing International Corporation ("SMIC";) and Qualcomm Incorporated, have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm® Snapdragon™ processors.

From Semiconductor Manufacturing International Corporation (SMIC) 4 Jul 2014

Construction Continues on Computer Chip Commercialization Center as Part of ‘Nano Utica’ Initiative

As part of the $1.5 billion “Nano Utica” initiative that was recently announced by New York Gov. Andrew Cuomo to further build upon the state's successful nanotechnology-based economy, construction continues on the Computer Chip Commercialization Center — informally known as Quad-C.

From College of Nanoscale Science and Engineering, University at Albany 2 Jul 2014

Synopsys and IIT Bombay Partner to Advance NBTI Modeling in FinFET Devices

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, and the Indian Institute of Technology, Bombay, today announced a collaboration to advance the modeling of negative bias temperature instability (NBTI), a key reliability concern for advanced CMOS devices.

From Synopsys, Inc. 2 Jul 2014

Crossbar Provides Further Details on Non-Volatile Resistive RAM Technology

Crossbar, Inc., a start-up company pioneering 3D Resistive RAM (RRAM) technology, today disclosed further details behind its revolutionary non-volatile RRAM technology.

2 Jul 2014