Achronix Semiconductor Corporation announced today that it has begun shipping the industry-leading Speedster®22i HD1000 FPGA to customers. Built on Intel's advanced 22nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices consume half the power and are half the cost of competitive high-end FPGAs for targeted high bandwidth applications. They are the only FPGAs with a full suite of hardened interface IP including 10/40/100G Ethernet, 100Gbps Interlaken, PCI Express Gen1/2/3 and 2.133 Gbps DDR3 controllers.
For the first time, researchers have designed a special material interface that has been shown to add to and to improve the functioning of non-silicon-based electronic devices, such as those used in certain kinds of random access memory (RAM).
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a "nano-shish-kebab," consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.
OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new 20 nanometer (nm) NAND flash version of its award-winning Vertex 3 SSD Series.
Organic semiconductors hold promise for making low-cost flexible electronics – conceivably video displays that bend like book pages or roll and unroll like posters, or wearable circuitry sewn into uniforms or athletic wear. Researchers have demonstrated the ability to "print" transistors made of organic crystals on flexible plastic sheets, using technology that resembles inkjet or gravure printing.
Micron Technology, Inc. today introduced the industry's smallest 128-gigabit (Gb) NAND flash memory device utilizing its award-winning 20-nanometer (nm) process technology. The new 128Gb device stores three bits of information per cell, called triple-level-cell (TLC), creating a highly compact storage solution.
Dr. Jorge Seminario, the Lanatter and Herbert Fox Professor in the Artie McFerrin Department of Chemical Engineering at Texas A&M University, was recently honored twice in Lima, Peru, for his professional accomplishments.
Supercapacitors are a curiously neglected aspect of electronics and electrical engineering with a multi-billion dollar market rapidly emerging. Supercapacitors, sometimes called ultracapacitors, are electrostatic, not electrochemical devices. Unlike batteries, they can be fully discharged for transport and maintenance. Their behavior is more predictable and they are more tolerant of faults and damage. In the past, they have been little used because they are expensive and they hold one tenth of the electricity per unit of volume or weight.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that I&C Technology Co., Ltd., a developer of mobile TV SoCs, has selected the Analog FastSPICE (AFS) Platform for analog, RF, and mixed-signal circuit verification.
Miniaturization of electronic components is reaching a physical limit. While the solution of three dimensional assembly has the advantage of reducing bulk, the manufacture of electrical connections in these new products remains a technological challenge. Biologists and physicists from the CEA, CNRS, Université Joseph Fourier and Inra in Grenoble have developed a system of self-assembled connections using actin filaments for 3D microelectronic structures. Once the actin filaments become conductors, they join the various components of a system together. The results are published in the February 10, 2013 issue of Nature Materials
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