Nanoelectronics News

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Researchers Develop Self-Assembled Actin Filament System for 3D Microelectronic Structures

Miniaturization of electronic components is reaching a physical limit. While the solution of three dimensional assembly has the advantage of reducing bulk, the manufacture of electrical connections in these new products remains a technological challenge. Biologists and physicists from the CEA, CNRS, Université Joseph Fourier and Inra in Grenoble have developed a system of self-assembled connections using actin filaments for 3D microelectronic structures. Once the actin filaments become conductors, they join the various components of a system together. The results are published in the February 10, 2013 issue of Nature Materials

13 Feb 2013

Nanoelectronics Researcher to Receive ECS Award for Innovative Semiconductor Study

For innovative research on semiconductor devices, NJIT Professor Durgamadhab (Durga) Misra, the associate chair for graduate programs in the Newark College of Engineering (NCE) Department of Electrical and Computer Engineering, will receive two Division Awards next May, the 2013 Electronic and Photonic Division Award and the 2013 Thomas D. Collinan Award from the Dielectric Science and Technology Division of the Electrochemical Society (ECS). Misra is an ECS Fellow.

12 Feb 2013

Electron-Gas Interface Transistors May be Used for Developing Nano-Scale, Non-Volatile Memory Devices

Case Western Reserve University is leading an international investigation of a finicky alternative to silicon-based electronics and its use in high temperatures or under radiation that would render traditional components useless.

8 Feb 2013

Commercial Scale Large-Area Graphene Now Available from Bluestone Global Tech in 24"x300" Films

Bluestone Global Tech (BGT) announces the addition of 24”x300” graphene films to their Grat-FilmTM product line. This marks the pioneering firm as ‘first-to-win’ in the race to avail graphene in sizes and volumes useful for industrial application.

7 Feb 2013

ProPlus Leverages DFY Knowledge to Meet Challenges of 45-nm Technology

ProPlus Design Solutions, Inc., the global leader for SPICE modeling solutions and the leading technology provider for design for yield (DFY) applications, expanded its business in 2012 to offer a fully integrated DFY product portfolio.

7 Feb 2013

GLOBALFOUNDRIES Certifies Cadence Technologies for 20-nm LPM Production Node

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has certified essential Cadence® technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).

7 Feb 2013

GLOBALFOUNDRIES and Synopsys Deliver Design Solution for 14 nm-XM FinFET Technology

GLOBALFOUNDRIES and Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the two companies have partnered to deliver a comprehensive design solution to accelerate the implementation of GLOBALFOUNDRIES’ 14 nm-XM FinFET offering.

From GlobalFoundries 7 Feb 2013

Cadence Gets Support from Foundry Partners for Virtuoso Advanced Node

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that two of its major foundry partners -- Samsung Foundry and GLOBALFOUNDRIES -- are supporting new Cadence® custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers. The two foundries are providing SKILL-based process design kits (PDKs) for the newly introduced Cadence Virtuoso® Advanced Node.

From Cadence Design Systems 6 Feb 2013

Tensilica DSP Helps TU Dresden Realize Low-Power Test Microchips

Technische Universität (TU) Dresden, a leading German university in the field of electrical engineering, today announced the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power (SLP) technology.

5 Feb 2013

UCLA Center for Function Accelerated nanoMaterial Engineering Awarded $5M to Advance Electronics

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures that could enable more energy efficient computers, mobile phones, and other electronic devices.

From University of California at Riverside 5 Feb 2013

Nanoelectronics News

Researchers Develop Self-Assembled Actin Filament System for 3D Microelectronic Structures

Nanoelectronics Researcher to Receive ECS Award for Innovative Semiconductor Study

Electron-Gas Interface Transistors May be Used for Developing Nano-Scale, Non-Volatile Memory Devices

Commercial Scale Large-Area Graphene Now Available from Bluestone Global Tech in 24"x300" Films

ProPlus Leverages DFY Knowledge to Meet Challenges of 45-nm Technology

GLOBALFOUNDRIES Certifies Cadence Technologies for 20-nm LPM Production Node

GLOBALFOUNDRIES and Synopsys Deliver Design Solution for 14 nm-XM FinFET Technology

Cadence Gets Support from Foundry Partners for Virtuoso Advanced Node

Tensilica DSP Helps TU Dresden Realize Low-Power Test Microchips

UCLA Center for Function Accelerated nanoMaterial Engineering Awarded $5M to Advance Electronics

Green Synthesis of Silver Nanoparticles Using Pomegranate Peel Extract

Breakthrough Nano Material Uses Sunlight to Tackle Pollution and Produce Energy

Building a Quantum Model with Nanoscale Carbon Molecules

Thermo Fisher Scientific Introduces the Vulcan™ Automated Lab to Transform Semiconductor Analysis

Nanotechnology Could Improve Odds in Treating Aggressive Breast Cancers

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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