Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that I&C Technology Co., Ltd., a developer of mobile TV SoCs, has selected the Analog FastSPICE (AFS) Platform for analog, RF, and mixed-signal circuit verification.
Miniaturization of electronic components is reaching a physical limit. While the solution of three dimensional assembly has the advantage of reducing bulk, the manufacture of electrical connections in these new products remains a technological challenge. Biologists and physicists from the CEA, CNRS, Université Joseph Fourier and Inra in Grenoble have developed a system of self-assembled connections using actin filaments for 3D microelectronic structures. Once the actin filaments become conductors, they join the various components of a system together. The results are published in the February 10, 2013 issue of Nature Materials
For innovative research on semiconductor devices, NJIT Professor Durgamadhab (Durga) Misra, the associate chair for graduate programs in the Newark College of Engineering (NCE) Department of Electrical and Computer Engineering, will receive two Division Awards next May, the 2013 Electronic and Photonic Division Award and the 2013 Thomas D. Collinan Award from the Dielectric Science and Technology Division of the Electrochemical Society (ECS). Misra is an ECS Fellow.
Case Western Reserve University is leading an international investigation of a finicky alternative to silicon-based electronics and its use in high temperatures or under radiation that would render traditional components useless.
Bluestone Global Tech (BGT) announces the addition of 24”x300” graphene films to their Grat-FilmTM product line. This marks the pioneering firm as ‘first-to-win’ in the race to avail graphene in sizes and volumes useful for industrial application.
ProPlus Design Solutions, Inc., the global leader for SPICE modeling solutions and the leading technology provider for design for yield (DFY) applications, expanded its business in 2012 to offer a fully integrated DFY product portfolio.
Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has certified essential Cadence® technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).
GLOBALFOUNDRIES and Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the two companies have partnered to deliver a comprehensive design solution to accelerate the implementation of GLOBALFOUNDRIES’ 14 nm-XM FinFET offering.
Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that two of its major foundry partners -- Samsung Foundry and GLOBALFOUNDRIES -- are supporting new Cadence® custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers. The two foundries are providing SKILL-based process design kits (PDKs) for the newly introduced Cadence Virtuoso® Advanced Node.
Technische Universität (TU) Dresden, a leading German university in the field of electrical engineering, today announced the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power (SLP) technology.
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