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Frost + Sullivan Presents New Product Innovation Award to Thin Film Electronics

The 2010 Frost & Sullivan Global New Product Innovation Award in Printed Electronic Memories is presented to Thin Film Electronics ASA ('Thinfilm'). The company is commended for its unique non-volatile, printable, polymer-based memory products.

From Frost and Sullivan 3 Mar 2011

IEEE, ASME Journal Publishes Technical Details of Smart NanoBattery

mPhase Technologies, Inc. a leader in the development of Smart Surfaces and advanced battery technologies announced today that an article describing some of the technical aspects of the Smart NanoBattery architecture is published in the IEEE/ASME Journal of Microelectromechanical Systems.

From MyPebble 3 Mar 2011

New HAPS-600 Series from Synopsys Extends FPGA-Based Prototyping Capacity

Synopsys, Inc. a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of the HAPS®-600 series, the highest capacity extension of the HAPS family of FPGA-based prototyping systems.

From Synopsys, Inc. 3 Mar 2011

ASSET's New Validation Tools for Future 22 nm-Based Intel Core Processor Designs

ASSET®, with its ScanWorks® platform for embedded instruments, is the first tools provider to launch third-party validation and debug tools for designs targeting future 22nm based Intel® Core™ processors for the desktop and mobile marketplaces. ASSET is the leading supplier of validation, test and debug tools for embedded instrumentation.

2 Mar 2011

Proteus LRC from Synopsys for Lithography Verification Process

SPIE Advanced Lithography—Synopsys, Inc. a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced Proteus LRC for lithography verification.

From Synopsys, Inc. 2 Mar 2011

DesignArt Networks Launches Third 40 nm System-on-Chip Platform

As DesignArt Networks introduces its ground-breaking 40nm DAN3000 SoC family with the launch of five distinct SoC chips, the company today announced its third base station SoC platform – the DAN3300.

2 Mar 2011

Analog Devices Introduces Three New iMEMS Gyroscopes

Analog Devices, Inc (ADI) is introducing three new high-performance, low-power iMEMS® gyroscopes with analog output specifically for angular rate (rotational) sensing in harsh environments.

From Analog Devices 2 Mar 2011

New Small Form Factor Processing Module from iVeia Features 28 nm Logic Technology

At Embedded World 2011, iVeia today announced the Atlas-I-Z7e™, a small form factor processing module featuring the newly launched Zynq™-7000 Extensible Processing Platform from Xilinx.

2 Mar 2011

Xilinx Unveils Industry's First Extensible Processing Platform

Xilinx, Inc. today unveiled the Zynq™-7000 family, the industry's first Extensible Processing Platform (EPP) developed to achieve the levels of processing and compute performance required in high-end embedded applications targeting markets such as video surveillance, automotive driver assistance, factory automation, and many others.

2 Mar 2011

CEA-Leti, Freescale to Continue Focus on Developing New MEMS Technology

Freescale Semiconductor and CEA-Leti, a leading research lab for micro-electromechanical systems (MEMS) products and technologies, have partnered for the past decade to combine their expertise in MEMS development.

From CEA-Leti 2 Mar 2011