Belgian nanoelectronics research centre imec and Kyocera Corporation announced today that Kyocera, the Japanese high-tech electronics company and manufacturer of photovoltaic (PV) cells, modules and systems, has joined imec’s industrial affiliation program (IIAP) to advance next-generation crystalline silicon solar cells.
University of Minnesota electrical engineering researchers have developed a unique nanoscale device that for the first time demonstrates mechanical transportation of light. The discovery could have major implications for creating faster and more efficient optical devices for computation and communication.
Chips that use light, rather than electricity, to move data would consume much less power — and energy efficiency is a growing concern as chips' transistor counts rise.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems and AMD today announced they have signed a multi-year agreement that gives AMD access to a range of Synopsys DesignWare® interface, memory compiler, logic library and analog IP on advanced 16/14-nanometer (nm) and 10-nm FinFET process technologies. Synopsys is also hiring approximately 150 AMD IP R&D engineers and gains access to AMD's leading interface and foundation IP.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing its six gigabit (Gb) low-power double data rate 3 (LPDDR3) mobile DRAM, based on advanced 20 nanometer (nm) process technology.
The emerging field of molecular electronics could take our definition of portable to the next level, enabling the construction of tiny circuits from molecular components. In these highly efficient devices, individual molecules would take on the roles currently played by comparatively-bulky wires, resistors and transistors.
Nova Measuring Instruments, a leading innovator and a key provider of optical metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading logic manufacturer selected Nova's Optical CD metrology solution to support the development and future manufacturing of its 10nm and 7nm technology nodes, covering both FEOL and BEOL applications in Litho, Etch, Deposition, CMP and Epi process steps.
Semtech Corporation, a leading supplier of analog and mixed-signal semiconductors, today announced that 64GSPS ADC and DAC cores are available utilizing IBM’s 32nm SOI technology for integration in high performance Digital Microwave System on Chip (SoC) solutions.
FlexTech Alliance today issued a dual-focused Request for Proposals (RFP) for flexible, printed product demonstrators (demos) and a functional electronic print leaflet.
TSMC today announced its 28-nanometer High Performance Compact (28HPC) process is in volume production, making it the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment. The achievement of this milestone demonstrates TSMC's commitment to providing industry-leading technology for customers looking to tap power and performance benefits in cost-effective SoC designs.
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