Jul 17 2009
Halocarbon Products Corporation, a leading worldwide producer of specialty fluorochemicals, has made significant strides in providing photoresist chemicals for the advanced development of silicon wafer circuitry. Chemically amplified photoresists, the most advanced and most sensitive coatings used in semiconductor photolithography, are essential for the pattern creation of newer and ever-shrinking silicon wafers.
"Photoresist fluorochemicals by Halocarbon help create the most sensitive and advanced coatings used in micro wafer patterns, as our chemical technology helps provide sensitivity to smaller wavelengths of light that is necessary for these smaller resolutions," according to Halocarbon CEO Peter Murin. "Our scientists have formulated certain fluoro-substituted monomers that give polymeric compositions the desired combination of transparency at shorter wavelengths, etch resistance and solubility. Photoresists made from Halocarbon polymerization monomers have been shown to exhibit very desirable properties for 197nm and 157nm photolithography."
A photoresist coating is applied to a silicon wafer, usually using a spin-casting technique, and the areas of the coated wafer not masked are exposed to an appropriate wavelength of light which causes the photoresist to change, creating the desired pattern.
"We have only begin to explore with our silicon chip industry customers the potential advantage of fluorosubstituted acrylate esters as monomers for the synthesis of these important coatings," adds Murin. "New, more selective methods for production and functionality are also being investigated."