FSI International declared that it has received several supply orders for its ORION single wafer cleaning systems. The company manufactures surface conditioning devices to suit microelectronics applications.
The company received the supply orders during the third quarter of fiscal 2011. The company is anticipated to transport the systems during the second half of this year.
ORION single wafer cleaning system
One client from whom the company has received orders is a memory device manufacturer. The memory device manufacturing client will utilize the system for applications such as middle-of-line (MOL) metal etch and front-end-of-line (FEOL) wet photoresist strip. In order to enhance cycle time performance and defectivity, memory producers are using the single wafer technology instead of batch immersion. Designed to offer short process duration and atomized spray bar, the ORION system is equipped to overcome the limitations of the batch immersion technology.
Another client from whom the company has received orders for the ORION system is a foundry producer. This client will utilize the system for back-end-of-line (BEOL) cleaning. Logic and foundry producers have discovered the fact that metal film stacks and low-k materials can be effectively cleaned using wet cleaning techniques when compared to conventional BEOL processes. The ORION’s closed chamber technology ensures elimination of ash and etch by-products effectively. The closed chamber technology also prevents the dielectric films and metals from undergoing galvanic corrosion.
FSI International offers a wide range of cleaning products including single-wafer and batch platforms for cryogenic aerosol, immersion, vapor and spray technologies.