Nordson MARCH, a company involved in plasma processing technology, has launched a plasma treatment system named FlexTRAK-WF. This less-expensive, cassette-based plasma treatment system that is also automated is capable of handling five wafer sizes with minimal hardware changes.
FlexTRAK-WF Plasma Treatment System
An incorporated aligner and robot automate the processing of several different wafers and other flat surfaces. The FlexTRAK-WF plasma treatment system provides increased throughput of about 50 wafers in an hour and also ensures excellent uniformity of plasma for descum, etching, and ashing processes involved in wafer-based packaging and other applications.
FlexTRAK-WF has two different wafer load stations that enable continuous production and reduced idle time. It uses multi-size aligner and global cassette stage technologies that favor in wafer processing of varying sizes from 3 in up to 200 mm, resulting in increased utility of system. decreased hardware changes and user involvement. It also employs technologies such as integrated wafer recognition to identify and rectify potential problems that include double-stacking, cross-slotting, and wafer protrusion, hence ensuring reliability of the equipment.
James Getty, vice president of Nordson MARCH’s Business Development and Applications stated that plasma treatment technology helps to improve quality in several wafer-based packaging applications that are showing gradual growth. FlexTRAK-WF plasma system enables the plasma treatment to be automated by increasing the size and quantity of wafers processed during one cycle, thereby decreasing costs and increasing throughput.