FSI International, a provider of surface conditioning equipment for the production of microelectronics, has proclaimed that a major foundry producer in Asia has agreed to adopt an ORION single wafer cleaning system.
ORION Single Wafer Cleaning System
The Asian foundry producer is adopting the system for the 28 nm cleaning processes of front-end-of-line. The company will also utilize the system for the all-wet photoresist removal applications based on the high-temperature ViPR process. It anticipates realizing the revenue for the single wafer cleaning system during the first quarter of 2012.
Most of the integrated circuit producers recognize that the ORION single wafer cleaning system’s novel closed chamber design allows the powerful and high-temperature ViPR process technology to be carried out safely for the all-wet elimination of highly entrenched photoresist. FSI International’s unique ViPR process technology minimizes defectivity, lowers material loss and cost of ownership. The design of the process chamber with an inbuilt spray bar decreases chemical consumption, reduces process time, enhances uniformity and improves particle removal.
The Asian foundry producer is the sixth customer accepting the novel system for sophisticated applications. FSI International’s extensive range of wafer cleaning solutions such as batch and single-wafer systems for cryogenic aerosol, vapor and spray technologies allows customers to reach their productivity targets and flexibility in their process performance. The company’s customer service program extends the operating life of deployed FSI equipment, which in turn allows its customers to achieve a better return on capital investment.