FSI International, a provider of surface conditioning technology, devices and support services for the production of microelectronics, has declared that it has received orders from a major equipment manufacturer for several ANTARES cryokinetic cleaning systems.
ANTARES Single-Wafer Cryokinetic Cleaning System
The new order further extends the installed base of the ANTARES cryokinetic cleaning system. The chip supplier is already using FSI International’s ANTARES system for different particle stripping processes. It will expand its capacity through this latest order for sophisticated technology generations. FSI International plans to deliver the systems in the fiscal year 2012.
The ANTARES system, a single-wafer, completely automated cryokinetic cleaning system with capabilities to strip nano-scale particles, is utilized for processing wafers having sizes of 200 and 300 mm. Cryokinetic processing technology is a zero-chemical, all-dry process that strips particles using the force of high-velocity cryogenic Ar/N2 aerosol, and decreases imperfections even on low-k porous films and copper without damaging the surface of the wafer. The high-efficient dry cleaning solution of the system can be utilized for several particle stripping applications in the back-end-of-line and front-end-of-line.
The ANTARES cryokinetic cleaning system has been utilized by most of the major logic device producers across the world, thanks to its yield enhancement and flaw reduction advantages at 28/32 nm process technology nodes.
FSI International offers a variety of cleaning products such as cryogenic aerosol technologies, spray aerosol technologies, and single- and batch-wafer systems for immersion to enhance the performance and productivity of its customers.