Sep 29 2014
Mentor Graphics Corp. today announced that the Analog FastSPICE (AFS™) Platform including AFS Mega and Eldo® have been certified for 16nm FinFET+ V0.9 process technology through TSMC's SPICE Simulation Tool Certification Program, and on-going certification of V1.0 is on track to be completed by November, 2014.
"The Mentor Analog FastSPICE Platform, AFS Mega and Eldo have successfully met the accuracy and compatibility requirements for 16nm FinFET+ technology. Customers can use TSMC 16nm FinFET+ technology to start their competitive designs with an accurate verification solution," said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division.
The Analog FastSPICE Platform provides fast circuit verification for nanometer analog, RF, mixed-signal, memory and custom digital circuits. For large circuits, the AFS Platform also delivers high capacity and fast, mixed-signal simulation, and it includes the industry's only comprehensive full-spectrum device noise analysis. For memory and other array-based circuits, AFS Mega delivers silicon-accurate simulation.
"Extending the certification of Analog FastSPICE, AFS Mega, and Eldo to TSMC's 16nm FinFET+ is another important milestone in our cooperation with TSMC," said Ravi Subramanian, general manager of AMS verification in the DSM division, Mentor. "By continuing to work closely with TSMC, we can provide assurance that our mutual customers have the nanometer verification platform that has the accuracy required for the most complex and highly integrated nanometer analog, mixed-signal, and RF designs."
The Mentor Graphics Calibre® and Olympus-SoC™ platforms have also been extended to meet certifications for TSMC's 16nm FinFET+ offering. The Olympus-SoC product supports TSMC's 16nm FinFET+ rule deck and provides pin access and routability improvements and advanced low-Vdd timing closure capabilities for setup and hold MCMM optimization. The Calibre xACT™ extraction product has improved runtime and accuracy levels so that mutual customers can take full advantage of the performance offered by TSMC's 16nm FinFET+ process.