Oxford Instruments Plasma Technology announce webinar on process solutions for GaN and SiC power semiconductor devices, 8th July 2015.
The potential energy efficiency savings from the adoption of wide band gap power semiconductor devices based on GaN or SiC has lead to significant research and development that is now beginning to be realised in commercially available devices. Many technical challenges have been addressed but further research is still on-going into higher performance, lower cost devices.
Oxford Instruments’ webinar on Wednesday 8th July at 4pm (UK) will compromise two talks, the first is on the process solutions available today, and the second examines current research that addresses the challenges of the next generation of devices.
The first talk by Chris Hodson, Oxford Instruments Product Manager for Power Semiconductor and ICT devices will present ‘Plasma etch and deposition processes for GaN and SiC power semiconductor devices’, and will be followed by Professor Iain Thayne, University of Glasgow Professor Ultrafast Systems (Electronic and Nanoscale Engineering) who will discuss ‘Silicon Compatible GaN Power Electronics’.
Professor Thayne is lead investigator on the UK PowerGaN Consortium, a £6.2 million, five year Programme Grant funded by EPSRC, comprising 33 researchers from the Universities of Bristol, Cambridge, Glasgow, Liverpool, Manchester, Nottingham and Sheffield investigating silicon compatible GaN power electronics components.
“Glasgow University and the UK PowerGAN Consortium are undertaking leading research using Oxford Instruments' high technology equipment, as the power semiconductor market moves towards GaN-on-Si.”, comments Chris Hodson, Product Manager at Oxford Instruments. “Successful development of GaN-on-Si enables the use of low cost, large diameter substrates and easier routes to high volume manufacture of power devices. This offers better performance and levels of efficiency than those presently available, and results in smaller, less costly, better performing and more efficient power devices, with improved commercial rewards.”
This webinar will be of interest to process and device fabrication researchers and engineers in wide band gap devices.
A live question-and-answer session will follow the presentation.
The complementary webinar will be presented on July 8th 2015 at 4pm (UK)
For full details and free registration: www.oxford-instruments.com/power
About Oxford Instruments plc
Oxford Instruments designs, supplies and supports high-technology tools and systems with a focus on research and industrial applications. Innovation has been the driving force behind Oxford Instruments' growth and success for over 50 years, and its strategy is to effect the successful commercialisation of these ideas by bringing them to market in a timely and customer-focused fashion.
The first technology business to be spun out from Oxford University, Oxford Instruments is now a global company with over 2300 staff worldwide and is listed on the FTSE250 index of the London Stock Exchange (OXIG). Its objective is to be the leading provider of new generation tools and systems for the research and industrial sectors with a focus on nanotechnology. Its key market sectors include nano-fabrication and nano-materials. The company’s strategy is to expand the business into the life sciences arena, where nanotechnology and biotechnology intersect
This involves the combination of core technologies in areas such as low temperature, high magnetic field and ultra high vacuum environments; Nuclear Magnetic Resonance; x-ray, electron, laser and optical based metrology; atomic force microscopy; optical imaging; advanced growth, deposition and etching.
Oxford Instruments aims to pursue responsible development and deeper understanding of our world through science and technology. Its products, expertise, and ideas address global issues such as energy, environment, security and health.
About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.
These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.