EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.
From left to right: Hermann Waltl, Executive Sales & Customer Support Director; Alexander Rank, Executive Corporate Functions Director; DI Erich Thallner, President; Aya Maria Thallner, Executive Vice President; Dr. Werner Thallner, Executive Operations Director; Paul Lindner, Executive Technology Director. Image Credit: EV Group
To further strengthen the company’s position in semiconductor and adjacent markets, Alexander Rank will support the company’s management team as executive corporate functions director effective immediately. Rank, who has been with the company for more than 10 years, will be responsible for finance and controlling, purchasing and human resources as well as other corporate functions in his new role.
EVG has sustained its growth unabated in recent years, including into its current financial year, which began on October 1, 2024. The company continuously invests in expanding its development and production capacities and further improving its global infrastructure to serve and support its manufacturing customers and development partners. The latest expansion phase was recently completed with the opening of its Manufacturing VI facility.
Among the drivers for EVG’s growth are artificial intelligence (AI) and high-performance computing (HPC) products, as well as sensors and central components for smartphones, gaming systems, and advanced driver assistance systems (ADAS), among others, which fuel strong demand for EVG's hybrid bonding and other leading process solutions.
To support further growth, EVG is also expanding its global workforce this year. During this financial year, well over 100 employees, also known as “EVG insiders”, are to be hired at EVG’s headquarters in Austria and its global subsidiaries.
About EV Group (EVG)
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vison of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.
