Graphene Manufacturing Group Ltd. ("GMG") is pleased to provide a business update on the commercialization progress of THERMAL-XR® Powered by GMG Graphene.
Figure 1. THERMAL-XR® Coated Electronics Heat Sink. Image Credit: GMG
Customer Engagement Update
GMG continues to make progress in testing with companies in multiple industries for the use of THERMAL-XR® in their products, including on heat sinks for electronics. Figure 1 shows an aluminium heat sink that is commonly used in electronics for removing heat from printed circuit boards, electrical circuits and processing silicon chips, and that has been coated with THERMAL-XR®.
Heat Sink Miniaturization:
Third-party verified modelling demonstrates that applying THERMAL-XR® to a heat sink could reduce its size by up to 39%, while maintaining equivalent thermal performance, offering the potential for weight and material cost savings. Figure 2 shows that the maximum temperature reached by a heat sink coated with THERMAL-XR® is 62 degrees centigrade, 23% lower than the maximum temperature of 80 degrees Celsius reached by a heat sink of equal size that has not been coated with THERMAL-XR®. Figure 3 shows that a heat sink coated with THERMAL-XR® that is 39% smaller in terms of width achieves the same performance as a heat sink that has not been coated with THERMAL-XR®.
Global Printed Circuit Board (PCB) production is projected to reach 530 million square meters annually by the year 2030, or about 5.3 trillion printed circuit boards. As PCB density increases, higher current loads lead to more heat, with 5.2 billion units expected to require heat sinks for cooling. THERMAL-XR® coated on the heat sinks, enhances the heat sink efficiency, enabling smaller heat sinks and more compact PCB assemblies. The total amount of THERMAL-XR® that could be used for this application to improve performance is 26.5 million liters per annum by 2030, assuming 0.1% will use the coating.
GMG's Managing Director and CEO, Craig Nicol, commented: "Heat sinks are a critical component of modern electronics, but they come with various challenges, especially as devices become smaller, faster, and more powerful. GMG's THERMAL-XR® offers a potential solution in heat sink miniaturization, enabling up to 39% size reduction while maintaining thermal performance. This has the potential to not only cut material costs but also unlock new opportunities for compact and efficient electronics designs, addressing the rising thermal management demands of the global printed circuit board market."