Nanofabrication News

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Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3).

19 May 2015

Kyocera Introduces Nano-Silver Technology-Based Lead-Free, Pressureless Sinter Paste

Kyocera America, Inc., Chemical Sales Division, today announced the U.S. introduction of its environmentally-friendly XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders.

19 May 2015

X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, have entered into a joint development agreement to industrialize Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production center where the two partner companies will manufacture GaN devices for the solar, industrial, automotive, IT electronics and other markets.

19 May 2015

CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX, developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT).

19 May 2015

Researchers Fabricate Electrically Conductive Nanocomposite Laminate with Less Graphene Loading

Researchers at the Department of Energy’s Oak Ridge National Laboratory (ORNL) have developed a new method for commercial-scale fabrication of graphene. This could lead to significant advances in flexible electronics, and could possibly change the manner in which graphene is viewed and utilized.

18 May 2015

ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the availability of a new ARM® Artisan® physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications.

18 May 2015

BESSTECH Receives $250,000 ENYA Investment to Accelerate Commercialization of Lithium-Ion Battery Technology

BESSTECH Announces $250K Investment from Eastern New York Angels Funding will accelerate commercialization of BESSTECH’s innovative lithium-ion battery electrode technology and enable hiring of key personnel.

From BESSTECH - Battery Energy Storage Solutions 14 May 2015

U.S DOE Awards Dais Analytic$1.2 Million Additional Funding to Commercialize NanoAir Membrane HVAC Technology

Dais Analytic Corporation, a commercial nanotechnology materials business selling its industry-changing technology into the worldwide energy and water markets, today announced it has been selected to receive additional funding of $1.2 million from the U.S Department of Energy (DOE) to further commercialize its Heating, Ventilation, and Air-Conditioning (HVAC) membrane technology for its NanoAir™ product.

From Dais Analytic Corporation 13 May 2015

Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

Cadence Design Systems, Inc. today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification.

From Cadence Design Systems 13 May 2015

ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

ANSYS simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies.

13 May 2015

Nanofabrication News

Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Kyocera Introduces Nano-Silver Technology-Based Lead-Free, Pressureless Sinter Paste

X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

Researchers Fabricate Electrically Conductive Nanocomposite Laminate with Less Graphene Loading

ARM and UMC Offer Artisan Physical IP Solution on 55nm

BESSTECH Receives $250,000 ENYA Investment to Accelerate Commercialization of Lithium-Ion Battery Technology

U.S DOE Awards Dais Analytic$1.2 Million Additional Funding to Commercialize NanoAir Membrane HVAC Technology

Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

Double-Layer Design Boosts Charge and Range of EV Batteries

Magnetic Nanocarbon Composite Cleans Chernobyl’s Wastewater

Dark Nanoparticles Make Kidney Stone Removal Faster and Safer

SNA-Based Drug Slow Cancer Progression 59-Fold in Animal Models

Explore PI’s Precision Motion Innovations for Life Sciences at Neuroscience 2025

Turning Almond Shells into Electronics: A Conversation on Laser-Induced Graphene

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

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