Dais Analytic Corporation, a commercial nanotechnology materials business selling its industry-changing technology into the worldwide energy and water markets, today announced it has been selected to receive additional funding of $1.2 million from the U.S Department of Energy (DOE) to further commercialize its Heating, Ventilation, and Air-Conditioning (HVAC) membrane technology for its NanoAir™ product.
Cadence Design Systems, Inc. today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification.
ANSYS simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies.
Water, when cooled below 32°F, eventually freezes — it's science known even to pre-schoolers. But some substances, when they undergo a process called "rapid-freezing" or "supercooling," remain in liquid form — even at below-freezing temperatures.
Technology in common household humidifiers could enable the next wave of high-tech medical imaging and targeted medicine, thanks to a new method for making tiny silicone microspheres developed by chemists at the University of Illinois.
Research and Markets has announced the addition of the "Nanoencapsulation for Food Products - Global Strategic Business Report" report to their offering.
Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it is the first company to deliver silicon-proven 28G NRZ SerDes IP on the TSMC 16-nanometer FinFET Plus (16FF+) process, and will demonstrate its high-performance, low power characteristics at the TSMC Symposium this week in Shanghai, China.
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aigner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required.
Micro actuators are needed for numerous applications, ranging from mobile and wearable devices to minimally invasive medical devices. However, the limitations associated with their fabrication have restricted their deployment at the one-millimeter scale. The most common electromagnetic motors require the miniaturization of many complicated components such as coils, magnets, and bearings, and exhibit severe torque dissipation due to the scaling. Electrostatic motors enable excellent scalability by using microelectromechanical systems (MEMS) technology, but their weak driving force has limited their further development.
SENTECH offers leading edge plasma process technology equipment for etching, deposition and thin film measurement instrumentation based on ellipsometry. The advanced SENTECH plasma equipment is based on the inductively coupled plasma source PTSA (planar triple spiral antenna) which was developed by SENTECH for low damage and high rate etching and deposition. The latest product development at SENTECH expands the ICPECVD product line by plasma enhanced ALD systems and in situ monitoring systems.
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