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Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Researchers at Binghamton University are focusing on printed electronics: using inkjet technology to print electronic nanomaterials onto flexible substrates. When compared to traditional methods used in microelectronics fabrication, the new technology conserves material and is more environmentally friendly.

23 Jun 2015

Quantum Effect Found in Atomically Thin Diode

Researchers at Penn State, UT-Dallas, Institute of Atomic and Molecular Sciences, and King Abdullah University of Science and Technology, have found that a novel quantum mechanical transport phenomenon demonstrated at room temperature in an atomically thin layered material could help develop new nanoelectronic devices and circuits.

23 Jun 2015

UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

United Microelectronics Corporation, a leading global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node. The 14nm cooperation expands on the two companies' successful effort to develop and offer ARM Artisan® Physical IP on UMC's volume production 28nm High-K/Metal Gate process.

22 Jun 2015

UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

Synopsys, Inc. and United Microelectronics Corporation today announced an expanded collaboration to include Synopsys DesignWare® Embedded Memory IP and the DesignWare STAR Memory System® test and repair solution on UMC's second 14-nanometer (nm) FinFET process qualification vehicle (PQV).

From Synopsys, Inc. 22 Jun 2015

Webinar: Enabling Wide Band Gap Power Semiconductor Devices to Deliver Energy Efficiency Savings

Oxford Instruments Plasma Technology announce webinar on process solutions for GaN and SiC power semiconductor devices, 8th July 2015.

From Oxford Instruments Plasma Technology 17 Jun 2015

Stretchable, Transparent Conductors with Nano-Accordion Design for Flexible Electronics Applications

North Carolina State University researchers have developed flexible, transparent conductors with “nano-accordion” design. The conductors hold promise in different applications including wearable sensors, stretchable displays or flexible electronics.

From North Carolina State University 17 Jun 2015

KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics. In order to be used as a core memory for flexible devices, the most important issue is reducing high operating current. The effective solution is to decrease cell size in sub-micron region as in commercialized conventional PRAM. However, the scaling to nano-dimension on flexible substrates is extremely difficult due to soft nature and photolithographic limits on plastics, thus practical flexible PRAM has not been realized yet.

16 Jun 2015

ASU Develops Kirigami-Based Stretchable Batteries

Origami, the centuries-old Japanese paper-folding art, has inspired recent designs for flexible energy-storage technology. But energy-storage device architecture based on origami patterns has so far been able to yield batteries that can change only from simple folded to unfolded positions. They can flex, but not actually stretch.

16 Jun 2015

VLSI 2015 Symposia: imec to Present Record Number of 11 Papers

At this year’s on VLSI Technology and Circuits (June 15-19, 2015), nano-electronics research center imec will present a record number of 11 papers. Imec’s prominent presence at this renowned scientific meeting confirms its leading role in R&D on tackling the challenges to scale logic and memory architectures, and on advanced circuit design solutions.

From IMEC 16 Jun 2015

Synopsys-TSMC Collaboration to Develop Integrated IoT Platform on 40nm ULP Process Technology

Synopsys, Inc. today announced a collaboration with TSMC to develop an integrated Internet of Things (IoT) platform on TSMC's 40-nm ultra-low-power (ULP) process technology.

From Synopsys, Inc. 10 Jun 2015

Nanoelectronics News

Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Quantum Effect Found in Atomically Thin Diode

UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

Webinar: Enabling Wide Band Gap Power Semiconductor Devices to Deliver Energy Efficiency Savings

Stretchable, Transparent Conductors with Nano-Accordion Design for Flexible Electronics Applications

KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

ASU Develops Kirigami-Based Stretchable Batteries

VLSI 2015 Symposia: imec to Present Record Number of 11 Papers

Synopsys-TSMC Collaboration to Develop Integrated IoT Platform on 40nm ULP Process Technology

Harnessing Biology for Sustainable Energy Production

Calcium Carbonate Nanoparticles: Boosting T Cell Activation in Cancer Therapy

Low-Temperature Synthesis of Ultrathin Two-Dimensional Materials via BiOCl-Assisted CVD

Novel Method for Producing Superior Carbon Nanofibers via Additive Nanostructuring

Optimizing Methylene Blue Removal with Bovine Serum Albumin Nanoparticles

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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