Cypress Semiconductor Corp., a leading provider of embedded nonvolatile memory solutions, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that UMC licensed Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) for the 40-nanometer process technology node.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that United Microelectronics Corporation, a leading global semiconductor foundry, used Cadence® implementation and signoff tools to produce a silicon-ready 28nm ARM® Cortex®-A7 MPCore-based system on chip (SoC) targeting entry-level smartphones, tablets, high-end wearables and other advanced mobile devices.
Researchers at the University of Copenhagen have developed a new type of superconducting ‘nanowire’ crystal that holds great promise for future semiconducting electronics. These crystals, on the atomic scale, fuse metallic and semiconducting materials.
Global Unichip Corp. (GUC), the Flexible ASIC Leader™, and Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC's 16-nm FinFET+ process technology.
As he continues to carry out scientific research at the molecular level - holding out the prospect of nano-scale electronics that offer massive increases in processing power - the University of Huddersfield's Dr Nathan Patmore is moving directly from one major award to a prestigious new source of funding.
If the new nano-machines built at The Ohio State University look familiar, it’s because they were designed with full-size mechanical parts such as hinges and pistons in mind.
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference, which was recently held at Hong Kong Science Park.
The Universities of Bath, Bristol, Sheffield and Strathclyde and their industrial partners have been given funding to develop the UK into a future hub for the manufacture of advanced semiconductor materials.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has started mass producing the industry’s first 8 gigabit (Gb), low power double data rate 4 (LPDDR4) mobile DRAM based on the company’s leading-edge 20-nanometer (nm) process technology. LPDDR memories are the most widely used “working memory” for mobile devices worldwide.
A door has been opened to low-power off/on switches in micro-electro-mechanical systems (MEMS) and nanoelectronic devices, as well as ultrasensitive bio-sensors, with the first observation of piezoelectricity in a free standing two-dimensional semiconductor by a team of researchers with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory (Berkeley Lab).
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