Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology.
Cypress Semiconductor Corp., a leading provider of embedded nonvolatile memory solutions, and Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, today announced the companies have developed functioning silicon cells using Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) at the 55-nanometer process technology node.
SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.
Dr. Wilhelm Auwärter and his team are working on a research project to develop tiny flat molecule tapes at the Department of Physics of Technische Universität München (TUM). These structures could find versatile applications. Via direct coupling on a silver surface, the scientists successfully formed dimers and short chains of porphine molecules without contaminating by-products.
From their origins in the 1940s as sequestered, room-sized machines designed for military and scientific use, computers have made a rapid march into the mainstream, radically transforming industry, commerce, entertainment and governance while shrinking to become ubiquitous handheld portals to the world.
The rapid development of miniaturized portable electronic devices, such as micro-electromechanical systems, microrobots and implantable medical devices, has stimulated intense demand for micro-scale power sources.
Raytheon Company and the University of Massachusetts Lowell have announced an agreement to establish a joint research facility focused on the advancement of innovative technologies in a collaborative, state-of-the-art institute. Raytheon is committing $3 million with options to $5 million throughout the next 10 years for establishment of this research facility.
Intel today disclosed details of its newest microarchitecture that is optimized with Intel’s industry-leading 14nm manufacturing process. Together these technologies will provide high-performance and low-power capabilities to serve a broad array of computing needs and products from the infrastructure of cloud computing and the Internet of Things to personal and mobile computing.
Diablo Technologies is pleased to announce that its industry-leading NanoCommit™ solution has won Best of Show for Most Innovative Flash Memory Technology at the 2014 Flash Memory Summit in Santa Clara, Calif.
No longer just fantastical fodder for sci-fi buffs, cyborg technology is bringing us tangible progress toward real-life electronic skin, prosthetics and ultraflexible circuits. Now taking this human-machine concept to an unprecedented level, pioneering scientists are working on the seamless marriage between electronics and brain signaling with the potential to transform our understanding of how the brain works — and how to treat its most devastating diseases.
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