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Nova T600 Accurately Controls Processes of Complex Vertical Structures for Beyond 22 nm Nodes

Nova Measuring Instruments has introduced an optical critical dimension (Optical CD) metrology system called Nova T600, which controls the processes of sophisticated vertical architectures for 22 nm nodes and beyond.

Nova T600

During its assessments with major foundry and memory companies, Nova T600 illustrated considerable process enhancements, including four- fold more measurement sensitivity on key profile attributes of sophisticated three dimensional applications.

Optical CD is the suitable system to measure and control the more sophisticated three dimensional structures, including buried-gate DRAM, stacked NAND and FinFET. The latest Nova T600 has a multi-channel reflectometry characteristic called oblique incidence spectroscopic reflectometry in combination with normal-incidence reflectometry. The combination offers superior sensitivity on tiny aspects, including the bottom layer of structures having high-aspect-ratio.

The Nova T600 displays a superior signal-to-noise feature, enabling excellent performance on the entire line of profile metrology applications. The upcoming version of the NovaMARS application development software features unique algorithms to enhance accuracy of measurements. The Nova T600 system in combination with NovaMARS completely supports a concept known as the Holistic Metrology Approach model launched by Nova, which is the simultaneous optimization of data from several sources.

The system fulfills the cost of ownership needs of semiconductor clients via modular metrology, superior TPT and the ability to enhance tool type and optical structure. It is compatible with complete frame low vibration T-platform, which can be setup to support several metrology units and load ports.

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