The EM TXP from Leica Microsystems (UK) is a target preparation device for sawing, grinding, polishing, and milling samples before examination by TEM, LM, and SEM techniques.
An integrated stereomicroscope facilitates the identification and easy preparation of barely visible targets.
With the specimen pivot arm, it is possible to observe the sample directly at an angle between 0 ° and 60 °, or 90 ° to the front face to determine distance with an eyepiece graticule.
Key Features
Integrated Automatic Process Control
Integrated process control with the automatic E-W guiding mechanism, countdown functions, and force-regulated feed control saves users from laborious routine sample preparation.
Surface Finish and Target Examination
Surface finish and target analysis with the in-built stereomicroscope means that users do not have to transfer the sample to estimate distance and surface evaluation, which increases user efficiency.
Variety of Tool Inserts
A range of tool inserts allows the specimen to be sawed, milled, ground, polished, and drilled without the need to remove the sample from the system. The ability to observe the process via the stereomicroscope saves time and money.
Image Credit: Leica Microsystems - Nanotechnology & EM Sample Preparation - EMEA
Inspection of Multilayer Samples
Workflow in Quality Control
Combining the target surfacing system Leica EM TXP with the light microscope Leica DM2700 M reduces the required procedure, streamlines the workflow, and produces precise and reliable results.
Image Credit: Leica Microsystems - Nanotechnology & EM Sample Preparation - EMEA