Nanoelectronics News

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SUSS MicroTec Completes Installation of ELP300 Excimer Laser Stepper for 3D IC Laser Debonding Applications

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

From SUSS MicroTec AG 21 Nov 2013

Forecast Report on Worldwide Graphene Electronics Market

Research and Markets has announced the addition of the "2013 Report on the Worldwide Graphene Electronics Market - with Forecast to 2023" report to their offering.

From Research and Markets 20 Nov 2013

TI Introduces Nanopower Boost Charger with Integrated Step-Down Regulator

Texas Instruments (TI) today introduced five new next-generation power management integrated circuits that efficiently acquire and manage microwatts (uW) to milliwatts (mW) of power harvested from light, heat or mechanical energy sources. The bq25570, bq25505, TPS62740, TPS62737 and TPS62736 maintain the industry’s lowest levels of active quiescent current and enable battery-free operation to wireless sensor networks, monitoring systems, wearable medical devices, mobile accessories and other applications with limited access to power.

19 Nov 2013

Flexible Electronic Circuit Boards Made Using Elastomeric Foams

Using foam substrates, EPFL scientists were able to make a flexible electronic circuit board. This discovery could lead to the creation of deformable and stretchable circuits.

16 Nov 2013

Surface Oxygen Used to Grow Large Single Graphene Crystals on Copper

When it comes to the growth of graphene — an ultrathin, ultrastrong, all-carbon material — it is survival of the fittest, according to researchers at The University of Texas at Austin.

15 Nov 2013

GSS Statistical Compact Model Extraction Tool Adopted by TSMC for TCAD Device Analysis

Gold Standard Simulations (GSS) revealed today that TSMC has adopted the company's advanced statistical compact model extraction tool Mystic for TCAD device analysis.

13 Nov 2013

Berkeley Design Automation’s AFS AMS Selected by IOsemi for RF Front-End Mixed-Signal Design Verification

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IO Semiconductor Inc. (IOsemi), a fabless semiconductor company developing high-performance RF front-end devices for multi-band, multi-mode cellular applications, has selected the company’s Analog FastSPICE™ AMS (AFS AMS) for RF front-end mixed-signal design verification.

13 Nov 2013

Xilinx Commences Shipment of UltraScale Devices on TSMC's 20nm Process Technology

Xilinx, Inc. today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device. Xilinx UltraScale™ devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the Vivado® ASIC-strength design suite and recently introduced UltraFast™ design methodology.

12 Nov 2013

Specialty Foundry, XMC, Opens Office in California’s Silicon Valley

XMC, a fast growing specialty foundry, today announced it has opened an office in California's Silicon Valley to support the growing interest and demand for its semiconductor manufacturing offerings. The office will be the base for front-line sales and business development efforts in North America. It will be headed by industry veteran Keng Wong, who has been named Associate Vice President of US Sales.

12 Nov 2013

Vishay Intertechnology Launches Two New 940 nm High-Speed Infrared Emitting Diodes in Compact Side-View Packages

Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the introduction of two new 940 nm high-speed infrared emitting diodes in compact 3.2 mm by 2.51 mm by 1.2 mm clear SMD side-view packages. Based on GaAIAs surface emitter and multi quantum well (MQW) technologies, the VSMY14940 and VSMB14940 combine high radiant intensity and optical power with fast switching times.

8 Nov 2013

Nanoelectronics News

SUSS MicroTec Completes Installation of ELP300 Excimer Laser Stepper for 3D IC Laser Debonding Applications

Forecast Report on Worldwide Graphene Electronics Market

TI Introduces Nanopower Boost Charger with Integrated Step-Down Regulator

Flexible Electronic Circuit Boards Made Using Elastomeric Foams

Surface Oxygen Used to Grow Large Single Graphene Crystals on Copper

GSS Statistical Compact Model Extraction Tool Adopted by TSMC for TCAD Device Analysis

Berkeley Design Automation’s AFS AMS Selected by IOsemi for RF Front-End Mixed-Signal Design Verification

Xilinx Commences Shipment of UltraScale Devices on TSMC's 20nm Process Technology

Specialty Foundry, XMC, Opens Office in California’s Silicon Valley

Vishay Intertechnology Launches Two New 940 nm High-Speed Infrared Emitting Diodes in Compact Side-View Packages

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials