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NanoMarkets Releases New Report on Zinc Oxide Electronics Market

A new report from industry analyst firm NanoMarkets says that Zinc Oxide (ZnO) is emerging as an important electronics material, with sales of conductive coatings, electrode materials, and electronic devices using ZnO mo...

28 Sep 2010

Sunplus Adopts Cadence Encounter Digital Implementation System for Multimedia SoC Designs

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Sunplus Technology Co., Ltd. (TAIEX: 2401) (LSE: SUPD), a leading multimedia IC design company, adopted the Cadence Encounter® Digital Implementation (EDI) System for its multimedia system-on-chip (SoC) designs.

From Cadence Design Systems 28 Sep 2010

Gallium Manganese Arsenide Semiconductor Material Could Convert Heat into Electricity

Computers might one day recycle part of their own waste heat, using a material being studied by researchers at Ohio State University. The material is a semiconductor called gallium manganese arsenide. In the early onl...

28 Sep 2010

Researchers Develop Reversible Adhesion Method to Print Electronics on Difficult Surfaces

Geckos are masters at sticking to surfaces of all kinds and easily unsticking themselves, too. Inspired by these lizards, a team of engineers has developed a reversible adhesion method for printing electronics on a va...

27 Sep 2010

Merck Opens New Material Research Center

With the opening of a new research center, the pharmaceutical and chemical company Merck is underscoring the importance of chemical research at its corporate headquarters in Darmstadt. German Federal Chancellor Dr. Angel...

24 Sep 2010

Ghent University and imec Announces Creation of Caliopa

Ghent University (UGent) and imec today announced the creation of Caliopa, a spin-off from their world leading Photonics Research Group. An initial 2 million Euro in funding was raised from Baekeland, Fidimec, PMV-Vinnof...

From IMEC 24 Sep 2010

New Commercial Foundry Process from TriQuint Features Optical Lithography Technology

TriQuint Semiconductor, Inc., a leading RF front-end product manufacturer and foundry services provider, today announced the release of its latest 150mm Gallium Arsenide (GaAs) commercial foundry process, TQP15, to full production.

24 Sep 2010

Mass Production of Samsung’s 40nm-Class DDR3 Memory Modules

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is mass producing the highest density memory module for laptops and mobile workstations – an eight gigabyte (GB) small outline dual inline memory module (SoDIMM) or unbuffered dual inline memory module (UDIMM), based on 4-gigabit (Gb), 40 nanometer (nm)-class DDR3.

From Samsung Electronics 24 Sep 2010

Early Development of 32nm CMOS Technology to be Demonstrated at ICT 2010

STMicroelectronics, the leader of the EU Sixth Framework Program PULLNANO Advanced Technology Research and development project, today announced that PULLNANO has been selected and invited to be demonstrated at ICT 2010, an event organized by the European Commission and hosted by the Belgian Presidency of the European Union, to be held on September 27-29, 2010 in Brussels.

From STMicroelectronics 24 Sep 2010

New Nanomesh Can Aid in Development of Thermoelectric Devices

Computers, light bulbs, and even people generate heat—energy that ends up being wasted. With a thermoelectric device, which converts heat to electricity and vice versa, you can harness that otherwise wasted energy.

24 Sep 2010