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New Artificial Skin Developed Using Semiconductor Nanowires

Engineers at the University of California, Berkeley, have developed a pressure-sensitive electronic material from semiconductor nanowires that could one day give new meaning to the term "thin-skinned."

13 Sep 2010

Epitaxial Graphene Symposium to be Held from September 14 to 17, 2010

Scientists from around the world will gather next week to discuss the latest research findings at the Second International Symposium on the Science and Technology of Epitaxial Graphene. The conference is sponsored by ...

From GATECH - Manufacturing Research Center 13 Sep 2010

Leica Microsystems Introduces New Digital Microscope for Quality Analysis and Inspection

When the demands of quality inspection reach the limits of optical microscopes, digital technology provides QA professionals with the power to take visual analysis to the next level.

From Leica Microsystems GmbH 13 Sep 2010

Micro and Nano Miniature Connector Developer Expands Product Portfolio

Omnetics Connector Corp, the leading manufacturer of Micro and Nano miniature and high reliability connectors, has expanded its product line with the addition of the standard Micro-D connector.

10 Sep 2010

STMicroelectronics Introduces New Low-Power MEMS Microphone

STMicroelectronics, the leading supplier of MEMS for consumer and portable applications, has introduced a high-performance, low-power stereo microphone that throws down the gauntlet in sound quality and reliability at reduced size and cost.

From STMicroelectronics 10 Sep 2010

Fujifilm Succeeds in Micro-Particulation of BaFe Particle Using NANOCUBIC Technology

FUJIFILM Recording Media U.S.A., Inc. today announced it was able to demonstrate the long term archivability of Barium-Ferrite (BaFe) magnetic tape particle, withstanding realistic storage environment simulations and proving its reliability over more than a 30 year time period.

10 Sep 2010

Toppan Printing Develops New Photomask Process for 22nm and 20nm Devices

Toppan Printing Co., Ltd. today announced that it has developed a photomask manufacturing process at its facility in Asaka, Japan, to support 22nm and 20nm semiconductor device production. This process was developed t...

From Toppan Photomasks Inc. 10 Sep 2010

Nanoengineering Firm Kopin Secures Phase II SBIR Contract

Kopin® Corporation, the world’s leading producer of heterojunction bipolar transistor (HBT) wafers for smart phones and other mobile devices, announced today that it has received a two-year, Phase II Small Business Innovative Research (SBIR) contract for the development of Aluminum Indium Nitride-based high electron mobility transistors (AlInN HEMTs).

From Kopin Corp 10 Sep 2010

UMC Honored for Excellence in Nanotechnology Innovation

UMC (NYSE: UMC; TAIEX: 2303), a leading global semiconductor foundry, received the Industrial Technology Advancement Award in the category of Outstanding Enterprise Innovation Award from the Ministry of Economic Affairs.

From UMC 9 Sep 2010

FSA Unveils New MB86E50 Series Bridge Controllers Based on 65nm CMOS Technology

Fujitsu Semiconductor America, Inc. (FSA), a leading innovator of USB 3.0-compliant technology, has expanded its lineup of USB 3.0-SATA bridge controllers, introducing the new MB86E50 series for external USB 3.0 RAID sto...

From Fujitsu 9 Sep 2010