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Semiconductor Equipment Companies to Present Innovative Technologies at SEMICON Taiwan

SEMI Europe Grenoble Office announced today that 10 semiconductor equipment and solution providers will present their latest technologies at SEMICON Taiwan, Sept. 8-10, in the French Pavilion. The pavilion is organis...

4 Sep 2010

Researchers Fabricate High-Speed Graphene Transistors

Graphene, a one-atom-thick layer of graphitic carbon, has great potential to make electronic devices such as radios, computers and phones faster and smaller.

4 Sep 2010

Silver Nanoparticle Layer Can Boost Performance of Organic Transistors

A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics.

4 Sep 2010

Purdue's Supercomputers Help Design Advanced Nanoscale Electronics

WEST LAFAYETTE, Ind. - What may look like a shipping container dropped off a freight train onto a lot near the Purdue power plant is really a new home for the university's Steele supercomputing cluster. Purdue is ...

3 Sep 2010

Nanosys Establishes New Korean Subsidiary to Support Asian Customer Base

Nanosys, Inc., an advanced materials architect, today announced the opening of a new subsidiary, Nanosys Korea, Inc. with facilities in Gyeonggi-do, Korea. The company named former LG Electronics vice president Dr. Jong-...

From Shoei Electronic Materials, Inc 3 Sep 2010

Electronic Firms to Present at IFA 2010 Event in Hong Kong

Hong Kong is one of the world’s most important marketplaces for electronics. At IFA, from September 3rd to 8th, 55 companies from the metropolis will attend the trade fair to present their latest developments (2009...

2 Sep 2010

Georgia Tech Scientists Develop New Class of Devices Using Zinc Oxide Nanowires

Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.

2 Sep 2010

New Dispensing System from Nordson ASYMTEK Ideal for Wafer-Level Packaging

Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, introduces its S-920N-C stainless steel dispensing system that is third-party certified for Class 100 cleanroom use.

2 Sep 2010

GLOBALFOUNDRIES Introduces Qualification Vehicle Based on 28nm Technology

At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES announced it has taped-out a qualification vehicle based on the ARM® Cortex™-A9 dual processor [(LSE: ARM); (Nasdaq: ARMH)], an industry ...

From GlobalFoundries 2 Sep 2010

Texas Instruments Purchases Two Wafer Fabs in Japan

Texas Instruments Incorporated has completed its acquisition of two wafer fabs and equipment in Aizu-Wakamatsu, Japan, cost-effectively increasing the company's production capacity.

2 Sep 2010