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GLOBALFOUNDRIES to Bring New 90nm Flash Memory Technology to Market

At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES and Freescale Semiconductor announced plans to bring a new class of thin film storage (TFS) flash memory products to market on 90nm technology. ...

From GlobalFoundries 2 Sep 2010

World's Fastest Computer Chip Based on IBM's 45nm Silicon Technology

IBM today announced details of the world's fastest computer chip -- the microprocessor in a new version of the IBM mainframe that begins shipping to customers on Sept. 10.

2 Sep 2010

GLOBALFOUNDRIES Showcases Industry’s First Open-Access 28nm AMS Production Design Flow Development Kit

At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES showcased the industry’s first open-access 28nm Analog/Mixed-Signal (AMS) production design flow development kit. The company is making the flow available to customers as a platform to build upon proven foundry methodologies and enable successful design.

From GlobalFoundries 1 Sep 2010

Scientists Create First Two-Terminal Memory Chips Using Only Silicon

Rice University scientists have created the first two-terminal memory chips that use only silicon, one of the most common substances on the planet, in a way that should be easily adaptable to nanoelectronic manufacturing techniques and promises to extend the limits of miniaturization subject to Moore's Law.

31 Aug 2010

Study Shows That Aixtron Leads in the Multi-Wafer MOCVD Market

IMS Research’s Quarterly GaN LED Supply Report released last week determined that over 300 MOCVD systems were installed in Q2’10 to serve the rapidly growing high brightness (HB) LED market.

From AIXTRON SE 31 Aug 2010

Record Shipment of STATS ChipPAC’s Embedded Wafer-Level Ball Grid Array Units

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading semiconductor test and advanced packaging service provider, today announced it has achieved a major industry milestone in the volume ramp of embedded Wafer-Level Ball Grid Array (eWLB) technology with more than 35 million units shipped.

31 Aug 2010

KLA-Tencor Unveils New Wafer Edge Inspection and Metrology Tool

Today KLA-Tencor Corporation™, the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, announced the latest addition to its industry-leading VisEdge family of products: the VisEdge CV300R-EP edge metrology and inspection tool.

31 Aug 2010

ZOLL Medical Selects ADI’s iMEMS Technology for PocketCPR Device

Analog Devices, Inc. today announced that ZOLL Medical Corporation has selected ADI’s high performance iMEMS® technology to enable its palm-sized CPR (cardiopulmonary resuscitation) device that measures the rate and depth of chest compressions administered by rescuers.

From Analog Devices 27 Aug 2010

FlexTech Alliance to Develop Foldable Display for Nyx Illuminated Clothing

The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced a contract award to Nyx Illuminated Clothing Company to develop a foldable ...

27 Aug 2010

First DRAM Module Based on Nano Thermal Dissipation Technology

Golden Systems Middle East, a leading distributor of IT products, announced the launch of the world’s first invisible heat sink DRAM module, the KINGMAX DDR3 2200MHz with Nano Thermal Dissipation Technology, in the Middle East region.

27 Aug 2010