Toshiba America Electronic Components, Inc. (TAEC) is introducing 32nm double data rate Toggle Mode NAND, in multi-level cell (MLC) versions with densities of 64Gb, 128Gb and 256Gb and single-level cell (SLC) versi...
Superconductivity, where a material conducts electricity at very low temperature with no resistance, and therefore transmission wastes virtually no energy, has applications ranging from medical scanners to maglev trains. Until now, scientists have focused on atomic-scale phenomena to explain this mysterious property of some special compounds.
LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - has announced that Andrew Kintz, Manager, Open Technology Innovat...
Leading chemical service provider Doe & Ingalls Management, LLC, parent of Doe & Ingalls of North Carolina, LLC, announces that it has acquired Medford, Massachusetts-based Doe & Ingalls, Inc.
Reportlinker.com announces that a new market research report is available in its catalogue: MEMS : MEMS & Sensors for Smartphones.
MARKET TRENDS
Integration of MEMS components and sensors is not new to the mobi...
Tiny sensors known as accelerometers are everywhere. The near-weightless technology can measure the impact of a dangerous tackle on a football player's helmet, control the flow of highway and runway traffic, analyze ...
Sleek design and ease of use are just two of the main reasons consumers are increasingly attracted to tablets and e-readers. And these devices are only going to get better -- display technology improvements are on the way.
Out of sight is not out of mind for a group of Hong Kong researchers who have demonstrated that burying a layer of silver nanoparticles improves the performance of their organic electronic devices without requiring complex processing.
Tektronix, Inc., the world's leading manufacturer of oscilloscopes, today announced that its next-generation, scalable, performance oscilloscope platform will make broad use of IBM 8HP silicon germanium (SiGe) technology.
Mentor Graphics Corporation today announced that its Calibre® Design-to-Silicon solutions were key elements in the successful development of TSMC's 28nm Product Qualification Vehicle (PQV), a major milestone in the TSMC process development. Multiple Mentor products were used in the design of the PQV test chips, including the Calibre nmDRC and Calibre nmLVS tools for design verification, and Tessent™ test suite for silicon test.
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