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United Microelectronics to Purchase 300mm CMOS Manufacturing Tools from TI

United Microelectronics Corporation (UMC) (NYSE: UMC; TSE: 2303), today announced it will further increase its production capacity with the purchase of numerous advanced 300mm CMOS manufacturing tools. The tools wil...

From United Microelectronics Corporation 16 Jul 2010

X-FAB Introduces New High-Voltage Foundry Process

X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, today announced the industry’s first 100V high-voltage 0.35 micrometer foundry process.

16 Jul 2010

STMicroelectronics Selects Cadence QRC Extraction for 40nm Technology Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that STMicroelectronics, a global leader in integrated circuits for communications, consumer, computer, automotive and industrial applications, has standardized on Cadence® QRC Extraction for their 40-nanometer custom/analog designs.

From Cadence Design Systems 16 Jul 2010

Advancement in Microelectronics

Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.

16 Jul 2010

FOREMOST Project Success Paves Way for Development of 32, 28 nm Nodes

Cooperation between semiconductor manufacturers, materials and equipment suppliers, and researchers has ensured that the European microelectronics industry can continue to maintain its global position in consumer electronics product design and manufacture.

16 Jul 2010

NEXX to Deliver Sputter Tool to Wafer Bumping Facility in China

NEXX Systems– a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat sputter tool order for an Apollo physical vapor deposition system ...

15 Jul 2010

Mitsubishi Electric to Increase Wafer Production Capacity for Power Devices

Mitsubishi Electric Corporation announced today it plans to invest 6.5 billion yen to expand its wafer production capacity for power devices by approximately 2.5 times that of the previous fiscal year. The expansion, to be conducted in several stages, will be completed by April 2011.

15 Jul 2010

New Light Source from Cymer Enables Chipmakers to Boost Wafer Output

Cymer, Inc. (NASDAQ:CYMI) , the market's leading developer of light sources used to pattern advanced semiconductor chips, announced today the introduction of the ELS(TM) 7010x, the world's first field-selectable 30 ...

From Cymer, Inc. 15 Jul 2010

TI to Acquire Two Wafer Fabs in Japan

Texas Instruments Incorporated (TI) said today it will purchase two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan. The assets currently are operated by Spansion Japan Limited (SJL) and are being acquired under a court-approved plan of reorganization.

15 Jul 2010

Toshiba Builds New Fabrication Facility in Mie Prefecture, Japan

Toshiba Corporation (Tokyo: 6502) today announced that it has started construction of a state-of-the-art fabrication facility (fab), Fab 5, at Yokkaichi Operations, its memory production facility in Mie Prefecture, with ...

15 Jul 2010