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Micron Technology, Applied Materials, and Ultratech Joins imec IIAP on GaN-on-Si Technology

Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R+D program focuses on the development of GaN-on-Si (gallium nitr...

From IMEC 13 Jul 2010

Applied Materials’ Endura System Marks 20 Years of Achievement

Applied Materials, Inc. today celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of the semiconductor industry.

From Applied Materials Inc. 13 Jul 2010

UAT Expands Wafer Bumping Facility in Malaysia

Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia.

13 Jul 2010

Bayer MaterialScience Joins Holst Centre Flexible Electronics Research

Bayer MaterialScience AG, one of the world's largest producers of polymers and high-performance plastics, and Holst Centre, an open-innovation initiative by research organizations IMEC (Belgium) and TNO (The Netherla...

13 Jul 2010

Rudolph’s NSX System Chosen for MEMS Processing by Fraunhofer ISIT

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing.

From Onto Innovation 13 Jul 2010

FRT Expects Future Investment on Wafer Production Equipment

SEMI, the international association of semiconductor manufacturers, announced a significant increase of industry turnover during the beginning of 2010. This trend is confirmed by Fries Research & Techno...

From SEMI 13 Jul 2010

New AdvantEdge Mesa System Delivers Sub-Nanometer CD Uniformity

Applied Materials, Inc. today unveiled its new Applied Centura® AdvantEdge™ Mesa™ system for creating nano-scale circuit features with angstrom-level precision in next-generation DRAM, Flash and Logic devices.

From Applied Materials Inc. 13 Jul 2010

Applied Materials Unveils Avila System for TSV Production

Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via (TSV) technology for high-volume manufacturing. Seen as a critical technology for producing the world’s future mobile ...

From Applied Materials Inc. 13 Jul 2010

MicroProbe Launches New MEMS-Based Probe Card

MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product.

13 Jul 2010

Alchimer Secures Funding to Commercialize Nanometric Deposition Technology

Panasonic recognizes the potential of Alchimer's groundbreaking technology for depositing nanometric films used in IC interconnects and 3D through-silicon vias.

13 Jul 2010