Nanoelectronics News

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New Cost-Effective Technique to Produce Graphene in Large Numbers

Researchers at Rensselaer Polytechnic Institute have developed a simple new method for producing large quantities of the promising nanomaterial graphene.

22 Jun 2010

Nanoelectronics Experts to Present at SEMICON West 2010 in California

SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will highlight current research through a wide range of lectures and workshop sessions from July 13-15, in conjunction with SEMICON West 2010 in San Francisco, CA.

22 Jun 2010

Imec Demonstrates Integrated Electrical Sources of Surface Plasmons

Imec has fabricated electrical sources of surface plasmons, based on integrating light emitting diodes with metal-insulator-metal (MIM) waveguides. These sources, together with earlier work demonstrating plasmon detectors, are a prerequisite for making an interface between electronics and plasmonic circuits.

From IMEC 21 Jun 2010

Collaboration to Study Promising Application of GeSn for Future pMOS Devices

GeSn materials show promise, for example as embedded source/drain stressors for Ge channels in future pMOS devices. Imec has started a collaboration to assess the possible applications of GeSn materials, and to see how these applications could be implemented.

From IMEC 21 Jun 2010

Imec's CMORE Offering Extended with SiGe-MEMS Foundry Service and MPW Service

Imec extends its CMORE service with a SiGe-MEMS foundry service and a multi-project wafer (MPW) service for universities and research centers via its EUROPRACTICE IC service. Both services are based on a monolithically integrated SiGe MEMS baseline process and come with an extended design kit.

From IMEC 21 Jun 2010

Imec Reports Breakthrough for Next-Generation Vertical Flash Memories

Imec realized a vertical Flash transistor with Si plug diameters down to 20nm. The associated vertical Flash platform paves the way to scale Flash memory to the next nodes. The vertical device concept features enhanced performance at lower voltages as well as reduced cost.

From IMEC 21 Jun 2010

Elpida Collaborates with PTI, UMC to Advance 28nm 3D IC Integration Technologies

Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation, today announced their entry into a 3-way cooperation to advance 3D IC integration technologies for advanced processes includin...

21 Jun 2010

Synopsys Introduces Galaxy Characterization Solution

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced its Galaxy Characterization Solution.

From Synopsys, Inc. 18 Jun 2010

Mentor Graphics Supports TSMC's New 28nm AMS Reference Flow

Mentor Graphics Corporation today announced corporate-wide support for TSMC's new Analog/Mixed-Signal (AMS) Reference Flow 1.0, including analog IC simulation, physical and electrical verification, high-accuracy extraction and design for manufacturing (DFM).

18 Jun 2010

Graphene Producer Vorbeck Honored in New York Venture Summit

Graphene leader Vorbeck Materials is pleased to announce that it has been selected as a winner of the Top Innovator Award by the annual New York Venture Summit. The award recognizes cutting edge private companies driving the future of innovation.

From Vorbeck Materials 18 Jun 2010