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Altos and Extreme DA Develop Signal-Integrity Design Flow for 65-nm IC Designs

Altos Design Automation Inc. and Extreme DA™ have jointly developed an essential signal-integrity (SI) design flow for integrated circuit (IC) designs manufactured at process nodes of 65-nanometers (nm) and below. M...

15 Jun 2010

TSMC Selects Silicon’s 3D Extraction Software for AMS Reference Flow

Silicon Frontline Technology, Inc. (SFT), the silicon-proven, full-chip, field-solver company, announced today that its F3D (Fast 3D) parasitic extraction software for post-layout verification, has been selected as part of TSMC's 28 nanometer (nm) Analog and Mixed-Signal (AMS) Referenced Flow 1.0. F3D was chosen because it offers parasitic extraction with guaranteed accuracy along with the capacity and performance to handle large nm designs.

15 Jun 2010

Magma's Talus and Quartz IC Systems Offer Nanometer Design Methodology

Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, today announced that Magma's Talus® and Quartz™ integrated circuit (IC) implementation and physical verification solutions have been i...

15 Jun 2010

CEA-Leti and Docea Power to Combine Expertise in 3D Silicon Integration and Thermal and Low-Power Design

CEA-Leti and Docea Power announced today that they will combine their expertise in 3D silicon integration and thermal and low-power design. Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools ...

From CEA-Leti 14 Jun 2010

Samsung Austin to Expand its 12-Inch Semiconductor Fabrication Facility in Texas

Samsung Austin Semiconductor LLC today announced plans to expand the capacity of its 12-inch semiconductor fabrication plant in Austin with a $3.6 billion investment.

From Samsung Electronics 11 Jun 2010

Samsung Qualifies 32nm Low-Power HKMG Logic Process Technology

Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, today announced that its foundry business, Samsung Foundry, has qualified 32nm low-power (LP) process with high-k metal gate (HKMG) technology.

From Samsung Electronics 11 Jun 2010

SiliconSmart ACE from Magma Supports UMC’s Move Towards 28-nm Technology

Magma® Design Automation (Nasdaq:LAVA), a provider of chip design software, today announced that UMC has standardized on SiliconSmart ACE for standard cell and I/O cell characterization and modeling. UMC co...

11 Jun 2010

Samsung Foundry Develops First 32-nm SoC Design with Synopsys' Galaxy Platform

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Samsung Electronics' Foundry business (Samsung Foundry) has successfully taped out its first 32-nanometer (nm) system-on-chip (SoC) design using Synopsys' Galaxy™ Implementation Platform.

From Synopsys, Inc. 11 Jun 2010

SEMATECH Reports Progressions in Wafer-to-Wafer Bonding Alignment

Researchers from SEMATECH’s 3D Interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through a series of tool and process hardening improvements.

11 Jun 2010

Simple Technique to Produce Nanowires

Scientists have made a breakthrough toward creating nanocircuitry on graphene, widely regarded as the most promising candidate to replace silicon as the building block of transistors.

11 Jun 2010