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Kodak, MacDermid to Provide High-Quality Film Solutions for Printed Electronics Applications

Kodak today announced that it has entered into a new partnership with specialty films manufacturer MacDermid Autotype to meet the growing needs of the printed electronics marketplace.

29 May 2010

eSilicon Acquires Silicon Design Solutions

eSilicon Corporation, the largest independent semiconductor Value Chain Producer (VCP), today announced that it has entered into a definitive agreement to acquire substantially all the assets of Silicon Design Solutions (SDS), a privately held supplier of niche semiconductor memory intellectual property (IP) cores.

28 May 2010

Elpida Develops 65nm XS Version 1-Gigabit DDR3 SDRAM for DRAM Market

Elpida Memory, Inc. (TOKYO:6665), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 65nm XS extra-shrink version 1-Gigabit DDR3 SDRAM that is as cost-competitive as 50nm process memory devices.

28 May 2010

Semiconducting Sandwich Filling Retains its Mystery

Oxides of transition metals such as titanium are of interest for applications, such as hydrogen gas sensors or as catalysts, and have intriguing fundamental physical properties. In particular, the origin of an intermedia...

27 May 2010

Tecella Launches New Lines of Amplifiers for Recordings from Nanopore Arrays

Tecella has released two lines of amplifiers targeted for recording from lipid bilayers.

27 May 2010

STMicroelectronics Adds New 3-Axis Accelerometer to its MEMS Portfolio

STMicroelectronics (NYSE: STM), the leading supplier of MEMS for consumer and portable applications, has extended its motion-sensor portfolio with a 3-axis digital-output accelerometer that combines a drastically reduced...

From STMicroelectronics 27 May 2010

Oclaro, ClariPhy Sign Agreement to Leverage 40nm CMOS Technology

Oclaro, Inc., a tier-one provider of innovative optical communications and laser solutions, today announced it has made a $7.5 million strategic investment in ClariPhy Communications, a privately-held fabless semiconductor company focused on digital signal processing (DSP) and mixed-signal integrated circuits (ICs) for high-speed next-generation networks.

27 May 2010

New BD180LV Process from Dongbu Supports Chip Design at 0.18-Micron Node

Dongbu HiTek today announced the addition of the BD180LV process to its portfolio of best-in-class BCDMOS process technologies.

27 May 2010

CEA-Leti and Nokia Research Center Develop Ultra-Wide Band Radio Front-end Circuit for Remotely Powered Memory Tag

CEA-Leti and Nokia Research Center (NRC) have developed an RF front-end circuit that allows very high data rate content exchange between a reader - typically a mobile phone - and a memory tag. This circuit is currently u...

From CEA-Leti 27 May 2010

Paradigm Shift in Information and Communication Technology

A silicon-based nanoscale system which aims to harness the 'spin' of electrons to boost the processing power of future computer systems is being developed by researchers at the University of Southampton, jointly with the University of Cambridge, the NTT Basic Research Laboratories and the Hitachi Cambridge Laboratory.

26 May 2010