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Applied Materials Offers Advanced Technology for Flexible Touch Panel Production

Applied Materials, Inc. reports that its flat panel display (FPD) and roll-to-roll coating systems are providing the advanced technology to enable more cost-efficient and scalable touch panel designs.

From Applied Materials Inc. 15 Apr 2010

American Semiconductor Completes 130nm Flexfet Chip Design

American Semiconductor today announced the first pass success of a 130nm chip design using their proprietary Flexfet technology and Silvaco's Mixed-Signal EDA tool flow. This advanced design, which was developed f...

15 Apr 2010

Intel Updates on Next Generation Core Processors Using 32-nm Microarchitecture

At its developer conference today, Intel Corporation demonstrated how the company is providing a foundation on which to build common hardware, software and ecosystem solutions to make computing experiences and devices work together seamlessly and easier to use.

15 Apr 2010

Azuro Announces Inclusion of its CTS Tool in Second ISF Release in 65nm from TSMC

Azuro, Inc., a leading provider of advanced clock tree synthesis and timing optimization tools for digital chip design, today announced the inclusion of its PowerCentric™ low power clock tree synthesis tool in the second release of TSMC’s Integrated Sign-off Flow (ISF) in 65nm.

From TSMC Taiwan Semiconductor Manufacturing Company 15 Apr 2010

Merck Announces Joint Effort to Develop New Plastic Electronic Display Technologies

Merck KGaA and Plastic Logic GmbH today announced plans to jointly develop, test and commercialize Merck’s new organic semiconductors in Plastic Logic’s displays.

15 Apr 2010

Three New Companies Join eBeam Initiative

The eBeam Initiative, a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB), today announced that several of its members will jointly present the lat...

14 Apr 2010

Compact Water-Circulation System Prevents Stacks of Electronic Chips from Getting too Hot

Electronic components generate a great deal of heat that can detrimentally affect device performance, particularly state-of-the-art high-power computer processors. Now, stacks of integrated electrical circuits can be coo...

13 Apr 2010

TSMC Skips 22nm Manufacturing Process Node and Move Directly to 20nm Technology

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) announced today at its 2010 Technology Symposium that it will skip the 22nm manufacturing process node and move directly to a 20nm technology. The move is value driven to make advanced technology a more viable alternative for its customers.

From TSMC Taiwan Semiconductor Manufacturing Company 13 Apr 2010

Engineers Dominate Two of the Most Influential Annual Academic Conferences

The engineers from the Department of Electrical and Computer Engineering (ECE) at the University of California, San Diego who are at the forefront of the latest "silicon revolution" will, for another year, dominate two of the most influential annual academic conferences focused on advanced wireless communications technologies - IMS 2010 and RFIC 2010.

13 Apr 2010

Applied Materials Opens Advanced Semiconductor Equipment Plant in Singapore

Applied Materials, Inc., the world’s leading supplier of equipment to the semiconductor, flat panel display and solar photovoltaic (PV) industries, today opened its new Singapore Operations Center, Applied’s first facility in Asia for manufacturing its advanced semiconductor equipment.

From Applied Materials Inc. 13 Apr 2010

Nanoelectronics News

Applied Materials Offers Advanced Technology for Flexible Touch Panel Production

American Semiconductor Completes 130nm Flexfet Chip Design

Intel Updates on Next Generation Core Processors Using 32-nm Microarchitecture

Azuro Announces Inclusion of its CTS Tool in Second ISF Release in 65nm from TSMC

Merck Announces Joint Effort to Develop New Plastic Electronic Display Technologies

Three New Companies Join eBeam Initiative

Compact Water-Circulation System Prevents Stacks of Electronic Chips from Getting too Hot

TSMC Skips 22nm Manufacturing Process Node and Move Directly to 20nm Technology

Engineers Dominate Two of the Most Influential Annual Academic Conferences

Applied Materials Opens Advanced Semiconductor Equipment Plant in Singapore

Sustainable Carbon Nanomaterial Gii Set to Transform Energy Storage in Internet of Things Devices

Sustainable Future for Carbon Nanotubes

Scientists Create the Largest Atomically Thin Gold Films to Make Electronics Weightless and Invisible

Sustainable ZnO Nanoparticles for Methylene Blue Cleanup

Enhancing Material Properties through Nanotube Encapsulation

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Conversations on AFM: Applications of BioAFM in Life Science

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