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AppliedMicro Announces First Member of APM 83K Series System on Chip Family

Applied Micro Circuits Corporation (NASDAQ:AMCC), or AppliedMicro, a global leader in energy conscious computing and communications solutions, today announced the first member of its APM 83K series System on Chip (SoC) family: APM 83290 - the highest performance Power Architecture® solution available in bulk CMOS process.

16 Oct 2009

TSMC and SVTC Forms Innovation Incubation Alliance

SVTC, the leading provider of silicon technology development and commercialization services, and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330) (NYSE: TSM) have formed an Innovation Incubation Alliance tha...

From TSMC Taiwan Semiconductor Manufacturing Company 15 Oct 2009

Applied Materials and Taiwan's ITRI to Accelerate Development of 3D Chip Stacking Technology

Taiwan's Industrial Technology Research Institute (ITRI) and Applied Materials, Inc. announced today a collaboration to accelerate the development and commercialization of 3D* chip stacking technology. To enable this important effort, a full line of processing systems from Applied Materials has been selected by ITRI for its 3D laboratory in Hsinchu, Taiwan.

From Applied Materials Inc. 15 Oct 2009

SMIC Extends 45-nm Bulk CMOS Technologies to 40nm and 55nm Geometries

Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and SEHK: 0981.HK) today announced that it will extend its 45-nanometer bulk complementary metal-oxide semiconductor (CMOS) technologies to 40nm and 55nm geometries.

From Semiconductor Manufacturing International Corporation (SMIC) 14 Oct 2009

Fujitsu Microelectronics Selects Cadence Advanced Verification Solution

Cadence Design Systems, Inc. , the leader in global electronic design innovation, announced today that Fujitsu Microelectronics Solutions Limited (FMSL) has adopted the Cadence® Incisive® metric-driven verificati...

From Cadence Design Systems 14 Oct 2009

Single-Molecule Diode Opens New Gateway in Electronics

Making components including diodes smaller, cheaper, faster and more efficient has been the holy grail of an exploding electronics field, now probing the nanoscale realm.

14 Oct 2009

Nanotechnology Professor Elected Fellow of Materials Research Society

Renowned materials scientist Robert Hull, the Henry Burlage Jr. Professor of Engineering and head of the Department of Materials Science and Engineering at Rensselaer Polytechnic Institute, was recently named a fellow of the Materials Research Society (MRS).

13 Oct 2009

Nemotek Technologie Introduces Miniaturized Wafer-Level Camera for Portable Applications

Nemotek Technologie today announced the availability of its miniaturized Wafer-Level Camera (WLC) for portable applications. By offering customizable Wafer-Level Optics (WLO), Wafer-Level Packaging (WLP) and now WLCs, Ne...

13 Oct 2009

Multi-Million Contract for Development of World's Most Advanced Semiconductor Wafer Fabrication Facility

The international engineering company M+W Zander has been awarded a contract for approximately 550 million Euro from GLOBALFOUNDRIES, the world's first truly global leading-edge semiconductor manufacturing company, t...

13 Oct 2009

STMicroelectronics Introduces New Motion Sensor

STMicroelectronics (NYSE: STM), a leading developer of automotive semiconductors and MEMS (Micro Electro-Mechanical System) technologies, has introduced a new motion sensor providing accurate measurements of vehicle movement for systems such as adaptive front lights, auto-levelling HID (high-intensity discharge) lamps, inertial brake lights, e-parking brake, advanced anti-theft systems and control of vehicle dynamics.

From STMicroelectronics 13 Oct 2009