Nanoelectronics News

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New Carbon-Nanotube Electrodes Enhance Ion Performance

Actuators are devices that convert electrical energy into mechanical energy, such as the battery-powered device inside a cell phone that causes the phone to vibrate.

11 Oct 2010

Vishay Intertechnology Offers Enhanced Thin Film Resistors

Vishay Intertechnology, Inc. today announced that it has extended its E/H MIL-PRF-55342-qualified Thin Film surface-mount resistor chips in the 0505, 1005, 1505, 0705, 1206, and 1010 case sizes to offer a "T" reliability level for space applications.

8 Oct 2010

New Insight on Material Bonding Aids Efficient Microchip Development

An approach pioneered by researchers at North Carolina State University gives scientists new insight into the way silicon bonds with other materials at the atomic level. This technique could lead to improved understan...

From North Carolina State University 8 Oct 2010

Researchers Use Nanotechnology to Develop New Computer Switches

Researchers at Case Western Reserve University have taken the first step to building a computer capable of operating in the heat of a jet engine or the sunny side of the planet Mercury. Te-Hao Lee, Swarup Bhunia and M...

8 Oct 2010

JSNN and RFMD Collaborate for Nanoelectronics Innovation

RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, and the Joint School of Nanoscience and Nanoengineering (JSNN) of UNCG and N.C. A&T have signed a Joint Research and Development, Facilities and Equipment Use Agreement.

7 Oct 2010

Durasonic Launches New Cleaning System Models for LED, Sapphire Wafers

Durasonic Corporation, a leading manufacturer of ultrasonic equipment, announced the launch of different models of its LED/Sapphire Wafer Cleaning Systems.

7 Oct 2010

NIST Awards $6 Million to Construct New Western Institute of Nanotechnology Building

The U.S. Commerce Department's National Institute of Standards and Technology (NIST) has awarded UCLA's Henry Samueli School of Engineering and Applied Science $6 million to support the construction of the new st...

From University of California, Los Angeles 7 Oct 2010

Camtek Wins New Order for Multiple Wafer Inspection Systems

Camtek Ltd. (NASDAQ and TASE: CAMT) ("Camtek"), announced today that it received an order for multiple wafer inspection systems from a major OSAT (outsourced semiconductor assembly and test) company in South Ea...

7 Oct 2010

CEA-Leti, SPTS to Develop New Processes for 3D-ICs

CEA-Leti and SPP Process Technology Systems (SPTS) today announced they have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti’s 300mm facilities in Grenoble, France.

From CEA-Leti 7 Oct 2010

UC’s Electrofluidics Breakthrough Enhances Image Capabilities of Electronic Devices

Today's Oct. 4 issue of the high-impact journal, Applied Physics Letters, contains a new electrofluidics design from the University of Cincinnati and start-up company Gamma Dynamics that promises to dramatically reshape the image capabilities of electronic devices.

6 Oct 2010