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ADT Secures SBIR Fund for Developing New Pad Conditioners

Advanced Diamond Technologies (ADT) received a Phase I Small Business Innovation Research (SBIR) grant from the National Science Foundation (NSF) to develop the next generation of chemical mechanical planarization (CMP) pad conditioners for the semiconductor industry.

15 Jul 2010

Breakthrough in Developing Quantum Nanowire

Rice University scientists have found the "ultimate" solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire ever closer.

15 Jul 2010

Adding Graphene to Battery Materials Reduces Recharge Time for Electronics

Adding a bit of graphene to battery materials could dramatically cut the time it takes to recharge electronics.

14 Jul 2010

Olympus-ITA to Exhibit 3D-IC Metrology Tool at SEMICON West 2010

Olympus Integrated Technologies America, Inc. (Olympus-ITA) will present its 3D-IC Automated Metrology System at SEMICON West 2010 in North Hall booth #6047.

14 Jul 2010

New JVX7200 Metrology System Launched for Sub 45nm Technology

Jordan Valley Semiconductors Ltd. (JVS), a leading provider of X-ray-based semiconductor in-line metrology tools, announced today the launch of its new JVX7200™, which targets the challenging SiGe in-line process mo...

14 Jul 2010

Genmark Introduces New Wafer Sorter

Genmark Automation Inc., a global leader in tool and factory automation solutions for the semiconductor manufacturing equipment industry, today announced the expansion of the SortMax wafer-sorter product line.

14 Jul 2010

Applied Materials to Showcase New Microchip Manufacturing Technologies

Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions at the Semicon West 2010, Intersolar North America and ASMC1 events in San Francisco this week.

From Applied Materials Inc. 14 Jul 2010

Availability of Soitec’s Fully Depleted Planar Technology on UTBOX Wafers

The Soitec Group, the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices.

14 Jul 2010

NEXX’s Stratus Tool Enables 300mm Lead-Free Wafer Bumping

Technology leaders in the emerging lead-free bumping market are meeting “green” global policy requirements, such as ROHS, by using NEXX Systems’ Stratus plating tool to produce their system-in-package (SiP) and 3D wafer-level packaging (3D WLP) devices.

14 Jul 2010

New 9900 System for Dicing Ultra-Thin Wafers from ESI

Electro Scientific Industries, a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry, today unveiled its new 9900 system for ultra-thin wafer dicing.

From Electro Scientific Industries (ESI) 14 Jul 2010