Nanoelectronics News

RSS

Leti to Highlight Latest Research Findings and Key Programs for Semiconductor Industry

At Semicon West, Leti will highlight some of its latest research findings and key programs for the semiconductor industry, including maskless lithography, FDSOI and 3D integration. The abstracts below summarize Leti&rsqu...

From CEA-Leti 1 Jul 2010

NEXX to Deliver Wafer Level Packaging Technologies to Unisem

NEXX Systems – a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat, multi-product order for an Apollo physical vapor deposition system and Stratus electrochemical deposition system to Unisem Advanced Technologies (UAT), a wafer bumping facility in Malaysia.

1 Jul 2010

TSMC Employs Berkeley’s Analog FastSPICE Platform in Nanometer AMS Reference Flow

Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that the Taiwan Semiconductor Manufacturing Company (TSMC) has incorporated the AFS Platform in the Analog Mixed Signal (AMS) Reference Flow 1.0 for device noise analysis.

1 Jul 2010

Verigy Extends V93000 Wafer Probing Platform with New Capability

Verigy, a leading semiconductor test company, has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe™ solution.

1 Jul 2010

Interconnect Insulators Need Enhanced Materials to Increase IC Speed

Integrated circuits, which enable virtually every electronics gadget you use on a daily basis, are constantly being pushed by the semiconductor industry to become smaller, faster, and cheaper. As has happened many times in the past and will continue in the future, integrated circuit scaling is perpetually in danger of hitting a wall that must be maneuvered around.

30 Jun 2010