Jul 1 2010
NEXX Systems – a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat, multi-product order for an Apollo physical vapor deposition system and Stratus electrochemical deposition system to Unisem Advanced Technologies (UAT), a wafer bumping facility in Malaysia.
Both systems will be used for WLCSP and bumping in support of Unisem’s industry leadership in flip chip packaging. The Stratus, already installed in UAT, was in production in less than two weeks from its delivery date.
Stratus electrochemical deposition system
The Unisem/NEXX partnership has been a strong success: NEXX Systems, an established multi-platform provider to UAT, provided accelerated system shipment and commissioning, as well as partnered with UAT to provide superior unit processes and low cost of ownership. NEXX Systems is committed to enabling its partners to consistently deliver technology leadership and cost effective production of wafer level packaging solutions.
Source: http://www.nexxsystems.com/