Nanoelectronics News

RSS

TLi Selects AFS Platform for Nanometer SPICE Accuracy

Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that Technology Leaders & Innovators (TLi), a leading fabless developer of display semiconductor products, has selected the AFS Platform for full-circuit verification and device noise analysis of its complex mixed-signal ICs for display applications.

23 Jun 2010

MOSIS Announces Collaboration to Provide 3D-IC Multi-Project Wafer Service

MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process. The first MPW run is t...

23 Jun 2010

BC5 Material Properties Can be Used to Design New Nano-Electromechanical System

What could be better than diamond when it comes to a superhard material for electronics under extreme thermal and pressure conditions? Quite possibly BC5, a diamond-like material with an extremely high boron content...

23 Jun 2010

Scientists Create First Rewritable Memory Device Using Liquid Crystal

As cell phones and computers continue to shrink, many companies are seeking better ways to store hundreds of gigabytes of data in small, low-power devices.

23 Jun 2010

Cambridge NanoTech Marks Milestone by Delivering 200th ALD System

Cambridge NanoTech, the world leader in Atomic Layer Deposition (ALD) science and equipment, today announced the delivery of its 200th ALD system.

23 Jun 2010

Alchimer Introduces New AquiVia Fill Process for High-Aspect-Ratio TSV Films

Alchimer S.A., a leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), today announced a groundbreaking advance for filling narrow, high-aspect-ratio TSVs while significantly reducing the need for chemical components in the metallization process.

23 Jun 2010

Initial investment to Develop Technological Applications for Future Electronics

Key executives of Bayer MaterialScience and the Singapore Economic Development Board officially opened today the company's new Functional Films Research Centre. The full-scale facility for upstream research will focus on coated high-tech films and nanotechnology to meet the ever-evolving and growing demand of the electronics market in Asia Pacific.

22 Jun 2010

Development of a Platform for Performance Evaluation at the Memory Array Level

Hiroyuki Akinaga, the Nanodevice Innovation Research Center of the National Institute of Advanced Industrial Science and Technology, and Hisashi Shima, Superior Nano-interface Device Research Team of the center, have dev...

22 Jun 2010

New 28nm FPGA Series from Xilinx Lowers Total Power Consumption by 50%

Xilinx, Inc. today announced the industry's first FPGA series that slashes total power consumption by 50 percent and offers industry-leading capacity of up to 2 million logic cells on the only unified architecture that scales across low-cost to ultra high-end families.

22 Jun 2010

Innofidei’s 65nm Low-Power SoC Achieves First-Pass Silicon Success with Cadence’s Solution

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Innofidei Inc., a leading mobile chipset provider based in Beijing, China, has successfully taped out the industry’s first long-term evolution time division duplex (LTE-TDD, or TD-LTE) baseband chip supporting a bandwidth of 20MHz for the next-generation TD-CDMA wireless communications protocol.

From Cadence Design Systems 22 Jun 2010