MOSIS Announces Collaboration to Provide 3D-IC Multi-Project Wafer Service

MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process.

The first MPW run is targeting January 2011:

• 2-tier face-to-face bonded wafers
• 130nm CMOS process for both tiers
• Top tier exposing TSV and backside metal pads for wire bonding

A design-kit supporting 3D-IC design with standard-cells and IO libraries is available.

Further MPW runs schedule supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different tiers) will be driven by users' requirements.

Source: http://www.mosis.com/