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Nanosys Signs Definitive Commercial Agreement with LG Innotek

Nanosys Signs Definitive Commercial Agreement with LG Innotek

Three-year Common Lab Agreement to Develop 3D Design Methodologies For Consumer and Wireless Applications

Three-year Common Lab Agreement to Develop 3D Design Methodologies For Consumer and Wireless Applications

Multiple Wavelength Laser Helps Silicon Chip See the Light

PI Introduces New Ultra-Low Profile Direct-Driven High-Speed Rotary Stage

PI Introduces New Ultra-Low Profile Direct-Driven High-Speed Rotary Stage

ICAP Ocean Tomo Sales Patent Portfolio Owned by Hymite

Companies Will Jointly Develop Technology and Processes for Scaling Up the Production of High-Quality Nanocomposites for Multiple Electronics Applications

Board Strengthens SVTC's Leadership Position in MEMS, Clean Energy and Advanced CMOS Markets

Nanotechnology Device Setting Stage for Realization of Next-Generation Ultra-Small Memories

Nanotechnology Streamlining the Process of Computer Electronic Packaging

Nanotechnology Streamlining the Process of Computer Electronic Packaging

Electric Control of Aligned Spins Improves Computer Memory

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