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MEMC Electronic Materials Receives Supplier of Excellence Award from TSMC

MEMC Electronic Materials, Inc. (NYSE:WFR) , a leading provider of silicon wafers and North America's largest solar energy services provider, has received the Supplier of Excellence award from Taiwan Semiconductor Ma...

From TSMC Taiwan Semiconductor Manufacturing Company 15 Dec 2009

NTU Launches Multi-Million IC Design Research Centre

In the near future, consumers can look forward to ultra-low powered or self powered electronic devices such as laptops, PDAs and mobile phones. This is made possible with power management and cutting-edge energy harvesti...

15 Dec 2009

Integration Features Lowers Overall Systems Component Counts

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today unveiled modular BCD (Bipolar, CMOS DMOS) process technologies targeting high voltage integrated LED driver devices. The new BCD technolo...

From TSMC Taiwan Semiconductor Manufacturing Company 15 Dec 2009

32nm e-MMC v4.4 Compliant Embedded Memories Combine Up To 64GB NAND and Controller in a Single Package

Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry.

15 Dec 2009

Setting New Standard in IP Characterization and Modeling for Designs Targeted at 28-nm and Below

Magma(R) Design Automation (Nasdaq:LAVA), a provider of chip design software, today announced SiliconSmart(R) ACE, a next-generation intellectual property characterization and modeling tool and the latest addition to the industry-standard SiliconSmart product line.

14 Dec 2009

Unidym Enters into Joint Development Agreement with Major LCD Manufacturer

Unidym, Inc, a majority-owned subsidiary of Arrowhead Research Corporation (NASDAQ: ARWR), announced today that it has entered into a joint development agreement with a major liquid crystal display (LCD) manufacturer.

14 Dec 2009

SmartKem Appoints The Scott Partnership to Drive PR Campaign

B2B PR agency The Scott Partnership has been appointed by innovative new start-up company SmartKem to drive a public relations campaign aimed at launching the innovative new company.

14 Dec 2009

3D Microprocessors Fitted on Supercomputers by 2015

The technological challenge is clear in terms of performance. But there is also an environmental stake. As John R. Thome, of the EPFL in Lausanne, explains: "In the United States, the industry's data centres already consume as much as 2% of available electricity. As consumption doubles over a five-year period, the supercomputers of 2100 would theoretically use up the whole of the USA's electrical supply!".

11 Dec 2009

UMC Showcases Unique 'Hybrid' High-K/Metal-Gate (HK/MG) Technology Approach for 28nm at 2009 IEDM

UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, presented today at the 2009 International Electron Device Meeting (IEDM) held here, a unique 'hybrid' high-k/metal-gate (HK/MG) technology appro...

9 Dec 2009

Concept Chip Aimed at Scaling On-Chip Performance

Researchers from Intel Labs demonstrated an experimental, 48-core Intel processor, or "single-chip cloud computer," that rethinks many of the approaches used in today's designs for laptops, PCs and servers. This futuristic chip boasts about 10 to 20 times the processing engines inside today's most popular Intel® Core™-branded processors.

9 Dec 2009