Nanoelectronics News

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First Off-the-Shelf High Resolution Sensor using Tower's Advanced 0.18-micron CIS Technology

First Off-the-Shelf High Resolution Sensor using Tower's Advanced 0.18-micron CIS Technology

20 Oct 2009
IMEC to Collaborate on Novel Packaging Technologies for Flexible Electronics

IMEC to Collaborate on Novel Packaging Technologies for Flexible Electronics

From IMEC 20 Oct 2009

Multi-Project Wafer Program Provides Economical Access to Flexfet Advanced Multiple Independent Gate FET CMOS Technology

19 Oct 2009

Synopsys Announces Special Three-Way Technical Session and Breakfast at ARM TechCon3

From Synopsys, Inc. 19 Oct 2009

NCKU Signs Agreement with Taiwan Nitride Material for Production of Aluminum Nitride

19 Oct 2009

UMC Completes EPD Verification for Integrated Circuit Wafers Produced at its Facilities

From UMC 19 Oct 2009
SMIC Adopts Cadence Solutions to Predict Stress and Lithographic Variability on Performance of 65- and 45-nm Semiconductor Designs

SMIC Adopts Cadence Solutions to Predict Stress and Lithographic Variability on Performance of 65- and 45-nm Semiconductor Designs

From Cadence Design Systems 19 Oct 2009
Results Prove SOI-Based Planar CMOS Meets Requirements for Low-Power, 22nm Node Devices

Results Prove SOI-Based Planar CMOS Meets Requirements for Low-Power, 22nm Node Devices

16 Oct 2009

Samsung's Latest Chip Innovation Combines RF and Digital Chip Components into Single 65 nm Chip

16 Oct 2009
Mentor Graphics Enters into Multi-Year Software and Services Agreement with GLOBALFOUNDRIES

Mentor Graphics Enters into Multi-Year Software and Services Agreement with GLOBALFOUNDRIES

From GlobalFoundries 16 Oct 2009

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