Multi-Project Wafer Program Provides Economical Access to Flexfet Advanced Multiple Independent Gate FET CMOS Technology

American Semiconductor, Inc., a complete silicon fabrication source, providing a complete suite of services to enable product realization from concept to fabrication, announces a Multi-Project Wafer (MPW) program for 180nm Flexfet CMOS process. This program provides access to Flexfet CMOS for ultra low power and radiation hardened electronics, enabling low cost proof-of-concept and prototype silicon on an advanced CMOS process.

“Our MPW program will enable wider access to Flexfet Multiple Independent Gate FET (MIGFET) CMOS technology,” said Doug Hackler, President and CEO of American Semiconductor. “Flexfet is similar in concept to FinFET in that both technologies have two controlled gates. Flexfet has a planar architecture with independently controlled gates that enables a commercially viable manufacturing flow suitable for volume production.”

Each MPW, or shuttle run, combines designs from multiple customers into one mask set and wafer lot. This allows costs to be shared across a number of program participants and provides a cost-effective method for prototype and proof-of-concept silicon. As an additional benefit, American Semiconductor’s direct MPW program allows customers to work directly with the foundry for design and process support.

“Our MPW program is ideal for military, aerospace, and defense customers that need economical prototype silicon,” said Rich Chaney, General Manager of American Semiconductor. “Additionally, the MPW program is a great benefit to small companies that need to provide results in silicon for SBIR programs. Our on-shore facilities are ITAR compliant and provide access to leading edge foundry processes and technology down to 65nm.”

Participating in American Semiconductor’s MPW program is straightforward. A customer reserves a MPW field and is provided a full FF180 Process Development Kit (PDK). Customers provide their designs as GDSII data and receive finished die after fabrication. Packaging services are available as an option for customers that prefer to receive packaged parts.