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Research Holds Promise for Nano-Scaled Electronics

IDT to Move from Fab-lite to Fab-less Model by Transferring Internal Fabrication Processes to TSMC

IDT to Move from Fab-lite to Fab-less Model by Transferring Internal Fabrication Processes to TSMC

"Door to the Future" Highlights Postdoctoral Program

System Specifically Designed for Plasma Etching Dielectric Films Required in Flexible Electronics Fabrication

System Specifically Designed for Plasma Etching Dielectric Films Required in Flexible Electronics Fabrication

BeSang Successfully Developed Multi-Layer Stacked 3D Integrated Circuit Technology

Researcher Wins Young Faculty Award from DARPA

Researcher Wins Young Faculty Award from DARPA

Developing Solar Cells Made From Low-Cost Plastics

Developing Solar Cells Made From Low-Cost Plastics

Frost + Sullivan Recognizes Organic Spintronics with Technology Innovation Award

World's Smallest Electric Motor

DEK Developed System Specifically for Processing Thinned Silicon Wafers

DEK Developed System Specifically for Processing Thinned Silicon Wafers

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