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Stratosphere Solutions StratoPro Tool Silicon-Proven at 32nm

Intel Moving to 34-nm Manufacturing Process for NAND Flash-Based SSD Products

Intel Moving to 34-nm Manufacturing Process for NAND Flash-Based SSD Products

New Manufacturing Facility Re-Establishes U.S. as Major Hub for Semiconductor Production

Mentor Graphics Expands Tools and Technologies Included in TSMC Reference Flow 10.0

Mentor Graphics Expands Tools and Technologies Included in TSMC Reference Flow 10.0

New Approach to 21st Century Electronic Materials And Devices

New Approach to 21st Century Electronic Materials And Devices

Cadence Advanced-Node Design and SiP Deliver Fast Time to Volume for Users of TSMC Process Technology

Cadence Advanced-Node Design and SiP Deliver Fast Time to Volume for Users of TSMC Process Technology

Cadence and TSMC Announces Broad Expansion of their Collaboration

Rudolph Technologies Receives Multiple Orders for Wafer Scanner and NSX Series Inspection Tools

Rudolph Technologies Receives Multiple Orders for Wafer Scanner and NSX Series Inspection Tools

Strasbaugh Receives $3.6 Million Order for Multiple nTellect Wafer Grinding Systems

Toshiba Deploys Magma's Talus IC Implementation Software for 90-, 65- and 40-nm Process Nodes

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