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New Memory Storage Medium that Can Pack Thousands of Times More Data

When it comes to data storage, density and durability have always moved in opposite directions - the greater the density the shorter the durability. For example, information carved in stone is not dense but can last thousands of years, whereas today's silicon memory chips can hold their information for only a few decades.

From Lawrence Berkeley National Laboratory 4 Jun 2009

SEMATECH to Host Workshop on 3D Interconnect Metrology

To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D Inter...

4 Jun 2009

Broadcom Corp Ships 65 nm Single-Chip GbE Switch Solutions to Major OEM Customers

Broadcom Corporation (Nasdaq: BRCM), a major technology innovator and global leader in semiconductors for wired and wireless communications, today announced that its family of 65 nanometer (nm) single-chip Gigabit Ethern...

4 Jun 2009

IMEC Demonstrates Spectrum Sensing Functions

IMEC, a world-leading independent research center in nanoelectronics and nanotechnology, has demonstrated spectrum sensing functions, using an experimental setup including its integrated reconfigurable radio platform.

From IMEC 4 Jun 2009

Nano-Researchers Developing Next Generation of Energy Efficient LEDs

Add the search for economical, long-lasting, brighter lights that use less energy to the list of energy topics occupying the attention of West Virginia University scientists and engineers. Clean coal technology, bioma...

3 Jun 2009

NREL Selects Aerosol Jet System to Reduce Cost of Production of Crystalline Silicon and Thin Film Solar Cells

Optomec, world-leading provider of additive manufacturing systems for high-performance applications in the Photovoltaic, Electronics, Biomedical, and Aerospace + Defense markets, announced today that the company's Ae...

From Optomec 3 Jun 2009

Quick, Accurate and Economical Way to Detect and Correct Pressure Variations in Wafer Bonding Process

Pressurex® film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process.

From Sensor Products Inc. 3 Jun 2009

mPhase Announces Participation in Smart Grid Implementation Summit

mPhase Technologies, Inc. (OTCBB:XDSL - News), through its wholly owned subsidiary AlwaysReady, Inc., is focused on developing and commercializing a new battery technology based on a well-patented phenomenon known as ele...

From MyPebble 3 Jun 2009

Argonne and BASF Signs Lithium-Ion Battery Technology Agreement

The U.S. Department of Energy's (DOE) Argonne National Laboratory and BASF, the world's largest chemical company, have signed a world-wide licensing agreement to mass produce and market Argonne's patented composite cathode materials to manufacturers of advanced lithium-ion batteries.

From BASF 3 Jun 2009

Bringing CMOS Photonics to Mainstream Markets

Luxtera, the worldwide leader in Silicon CMOS Photonics, today announced its collaboration with Freescale Semiconductor as its foundry source to achieve production of the world's first commercial Silicon CMOS Photonics semiconductor manufacturing process.

From Cisco Systems, Inc. 3 Jun 2009