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Leading Global Semiconductor Foundry Delivers Customer ICs Produced on its HP 40nm Process Technology

UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, today announced that it has delivered customer ICs produced on its High Performance (HP) 40nm process technology. The products were manufactured with ex...

From UMC 8 Apr 2009

Report Examines Economic Impact of Nanotechnology

Research and Markets has announced the addition of Nanotechnology Opportunity Report (NOR) 2008 to their offering. The Nanotechnology Opportunity Report (NOR) 2008, 3rd Edition provides the most comprehensive report ...

8 Apr 2009

New High-Energy Cathode Material Greatly Increases Safety and Life-Span of Future Lithium Batteries

A new high-energy cathode material that can greatly increase the safety and extend the life-span of future lithium batteries has been developed through the close international collaboration of researchers led by the U.S....

7 Apr 2009

First Nano Announces Participation in Two Industry Conferences and Trade Shows

First Nano, a division of CVD Equipment Corporation (NASDAQ: CVV), announced today that it will exhibit at the 7th Annual Nano Technology for Defense Conference, 6 - 9 April 2009 in Burlingame, CA and the Materials Resea...

From CVD Equipment Corporation 7 Apr 2009

Design Breakthrough Delivers Manufacturability of Future Devices While Utilizing Current Technologies

The ability to do more with less is about to become a reality as the chip industry is offered a way to increase performance without adding complexity. Semiconductor Research Corporation (SRC), the world's leading uni...

7 Apr 2009

First-Ever Nanoscale Fluidic Device with Complex 3-D Surfaces

Researchers at the National Institute of Standards and Technology (NIST) and Cornell University have capitalized on a process for manufacturing integrated circuits at the nanometer (billionth of a meter) level to engineer the first-ever nanoscale fluidic device with complex three-dimensional surfaces.

7 Apr 2009