Advanced Micro-Fabrication Equipment is unveiling its second-generation 300 mm ultra-high frequency advanced decoupled reactive ion etch (AD-RIE) system called the Primo AD-RIE tool, which is ideal for major process challenges at 22 nm and beyond at SEMICON West.
Primo AD-RIE Device
The Primo AD-RIE tool has technical advancements over its predecessor tool Primo D-RIE to assure better performance for on-wafer, while handling the difficulties in the manufacturing of leading-edge film stacks. It features improved chamber materials for minimum defects and better yields, superior flexible technologies to ensure ultra-precise uniformity of critical dimension and an innovative RF system for process repeatability and constancy.
The Primo AD-RIE features a unique mini-batch cluster design, that can include about three dual-station process modules for maximum output. Each module has the potential to process a single- or dual-wafer. The chamber’s novel design with showerhead technique and proprietary plasma confinement allows superior performance for on-wafer. A unique ESC improves temperature control for wafers and maximizes CD uniformity.
The etch tool Primo AD-RIE reduces cost of ownership by 20% to 40% and offers 35% to 50% of capital productivity gain. Its numerous critical features make it suitable for important process necessities at sub-28 nm.
Advanced Micro-Fabrication Equipment will deliver the first Primo AD-RIE in the third quarter of 2011 to a tier-one foundry in the Asian market. The utilization of predecessor Primo D-RIE device will be continued for all types of purposes over 22 nm, and for less important uses at 22 nm and beyond.