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  • Supplier Profile
    SUSS MicroTec is one of the world's leading manufacturers of production and test equipment in the field of microelectronics. Our products are geared towards market segments for high-quality...
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    NextGen Nanos breakthrough technology replaces existing solutions which are fabricated with pollutant materials with earth-friendly bio-polymers. This breakthrough enables NextGen Nano to develop...
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    LatticeGear is passionate about sample preparation and the under appreciated art of scribing and cleaving.   They help their customers get to the business of imaging and analysis faster. Their...
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    EuroPlasma designs, builds and sells turnkey vacuum plasma treatment equipment. Together with customers, EuroPlasma develops and optimizes the plasma process required to solve material problems and...
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    Nanostructures, Inc., has enabling technologies based on (a) patterned thin film devices on membranes and thin substrates and (b) bulk silicon etching of deep microstructures. These technologies make...
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    NanoPore, Incorporated was founded in 1993 with the purpose of commercializing high porosity/high surface area materials for a wide range of applications including adsorbtion, gas separation, advanced...
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    Micralyne is one of the largest independent MEMS foundries in the world. As an industry innovator and leader, Micralyne has a reputation of offering unparalleled MEMS product development and...
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    Chiral Photonics, Inc. (CPI) was formed in January 1999 to develop innovative products based upon the novel photonic properties of chiral structures. These devices have a screw-like, or helical,...
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    Applied Physics Technologies, incorporated in 1995 by William Mackie and Gary Cabe, is an outgrowth of research conducted for over a decade at Linfield Research Institute on transition metal carbides,...
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    Australian company, CAP-XX Pty Ltd develops and manufactures high surface area, thin film capacitors known as supercapacitors. The company has pioneered supercapacitor technology that leads the...

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